On-Chip Sensors for Temperature Monitoring of Packaged GaN MMICs
Journal article, 2024
A novel approach to on-chip temperature sensors for non-invasive thermal characterization and monitoring of packaged GaN MMICs is presented. The proposed sensor is fully compatible with commercial GaN foundry processes and enables improved reliability estimation of highly integrated systems. A dedicated test structure is developed to demonstrate the capabilities of the sensor, and an accurate calibration method of its temperature response is proposed. This combination allows for continuous temperature monitoring during operation with electrical acquisition of temperature transients. The method also enables the thermal characterization of the device and package.
MMIC
Temperature sensors
Monitoring
Thermal sensors
Semiconductor device packaging
Sensors
Sensor phenomena and characterization
MODFETs
Temperature measurement
Resistors
Electro-thermal effects
GaN
Author
Andreas Divinyi
Saab
Torbjörn M.J. Nilsson
Saab
Niklas Rorsman
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Tobias Kristensen
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Harald Hultin
Saab
Sten Gunnarsson
Saab
Mattias Thorsell
Saab
IEEE Transactions on Components, Packaging and Manufacturing Technology
2156-3950 (ISSN) 21563985 (eISSN)
Vol. 14 5 891-896Development of the national infrastructure for microwave and terahertz characterization: expanding the use of the electromagnetic spectrum
Swedish Research Council (VR) (2020-06187), 2021-01-01 -- 2024-12-31.
Subject Categories (SSIF 2011)
Robotics
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/TCPMT.2024.3387736