Fabrication and development of InP HEMTs on silicon substrate based on a new integration technique
Paper in proceeding, 2025
Current methods for transferring III-V technology onto silicon are based on wafer bonding techniques. Here we explore fabrication applicability of traditional InP-based High Electron Mobility Transistors (InP HEMTs) on InP-on-Si (InPoSi) wafers developed by Smart Cut, a method for transferring InP onto Si that reduces cost and fabrication complexity. We fabricated 100-nm gate length InP HEMTs, including test structures and Hall bars on both InPoSi and InP wafers. Transfer Length Method (TLM) measurements for InPoSi and InP bulk wafers showed comparable contact and sheet resistances. These preliminary results show that InP HEMTs can be fabricated on InPoSi.
Silicon Substrate
Fabrication Process
Integration Of Techniques
InP High Electron Mobility Transistors
Sheet Resistance
Contact Resistance
III-V semiconductor materials
Metal Organic Chemical Vapor Deposition
Electron Beam Lithography
High Electron Mobility Transistors
Hall Bar
Author
Francesco Fortunato
Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory
Nelson Rebelo
Low Noise Factory AB
Claire Besancon
III-V Lab
Florence Martin
III-V Lab
Bruno Ghyselen
Soitec SA
Jean Decobert
III-V Lab
Johan Bergsten
Low Noise Factory AB
Helena Rodilla
Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory
International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz
21622027 (ISSN) 21622035 (eISSN)
979-8-3503-7883-2 (ISBN)
2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
Helsinki, Finland,
Helsinki, Finland,
Sustainable Indium Phosphide (InP) platform and ecosystem upscaling, enabling future mass market (sub-)THz applications (Move2THz)
European Commission (EC) (EC/HE/101139842), 2024-05-01 -- 2027-04-30.
Chips JU 2023 RIA Move2THz
VINNOVA (2024-00556), 2024-06-01 -- 2027-05-30.
Areas of Advance
Information and Communication Technology
Nanoscience and Nanotechnology
Infrastructure
Kollberg Laboratory
Myfab (incl. Nanofabrication Laboratory)
Subject Categories (SSIF 2025)
Other Electrical Engineering, Electronic Engineering, Information Engineering
Nanotechnology for Electronic Applications
DOI
10.1109/IRMMW-THz61557.2025.11320086
ISBN
9798350378832