Parallel plate cavity mode suppression in microstrip circuit packages using a lid of nails
Journal article, 2009

The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits. © 2006 IEEE.

Gap waveguide

Microstrip circuit

Packaging

Mode suppression

Author

Eva Rajo

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

Ashraf Uz Zaman

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

Per-Simon Kildal

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

IEEE Microwave and Wireless Components Letters

1531-1309 (ISSN)

Vol. 20 1 31-33

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/LMWC.2009.2035960

More information

Created

10/7/2017