Parallel plate cavity mode suppression in microstrip circuit packages using a lid of nails
Artikel i vetenskaplig tidskrift, 2009

The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits. © 2006 IEEE.

Gap waveguide

Microstrip circuit

Packaging

Mode suppression

Författare

Eva Rajo

Chalmers, Signaler och system, Kommunikations- och antennsystem, Antennsystem

Ashraf Uz Zaman

Chalmers, Signaler och system, Kommunikations- och antennsystem, Antennsystem

Per-Simon Kildal

Chalmers, Signaler och system, Kommunikations- och antennsystem, Antennsystem

IEEE Microwave and Wireless Components Letters

1531-1309 (ISSN)

Vol. 20 1 31-33

Ämneskategorier

Annan elektroteknik och elektronik

DOI

10.1109/LMWC.2009.2035960

Mer information

Skapat

2017-10-07