Room temperature wafer bonding using oxygen plasma treatment in reactive ion etchers with and without inductively coupled plasma
Journal article, 2003

Author

Anke Sanz-Velasco

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

Petra Amirfeiz

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Stefan Bengtsson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

Cindy Colinge

Journal Of The Electrochemical Society

Vol. 150 2 G155-G162

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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