Impact of Bonding Interface Thickness on the Performance of Silicon-Integrated Hybrid-Cavity VCSELs
Paper in proceedings, 2016

The dependence of the performance of short-wavelength silicon-integrated hybrid-cavity VCSELs on the thickness of the bonding interface used for the heterogeneous integration has been studied. Performance measures investigated include the emission wavelength, thermal impedance, and variation of threshold current and output power with temperature.

semiconductor lasers

Heterogeneous integration

vertical-cavity surface-emitting laser (VCSEL)

silicon photonics

Author

Emanuel Haglund

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Sulakshna Kumari

Ghent university

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Erik Haglund

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Johan Gustavsson

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Roel G. Baets

Ghent university

Gunther Roelkens

Ghent university

Anders Larsson

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Conference Digest - IEEE International Semiconductor Laser Conference

08999406 (ISSN)

Article no 7765752- 7765752

Areas of Advance

Information and Communication Technology

Nanoscience and Nanotechnology (2010-2017)

Subject Categories

Telecommunications

Infrastructure

Nanofabrication Laboratory

ISBN

978-4-8855-2306-9

More information

Latest update

7/27/2018