Characterization of Substrate Materials for System-in-a-Package Applications
Journal article, 2004

Author

Liu Chen

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Anders Andrae

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Gang Zou

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Journal of Electronics Packaging

Vol. 126 2 195-201

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017