PBGA Interconnect Behavior under Thermal Effects
Paper in proceeding, 2007

Author

Yan Zhang

Chalmers, Applied Mechanics, Material and Computational Mechanics

Other publications Research

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Ragnar Larsson

Chalmers, Applied Mechanics, Material and Computational Mechanics

Other publications Research

Proceedings of International Conference on Electronics Packaging (ICEP2007), Tokyo, Japan

329-334

Subject Categories

Applied Mechanics

More information

Created

10/7/2017

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