Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects
Paper in proceeding, 2008
Author
Yan Zhang
Chalmers, Applied Mechanics, Material and Computational Mechanics
Ragnar Larsson
Chalmers, Applied Mechanics, Material and Computational Mechanics
Jing-yu Fan
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Proceedings of the 22nd International Congress of Theoretical and Applied Mechanics
978-0-9805142-0-9 (ISBN)
Subject Categories
Applied Mechanics
ISBN
978-0-9805142-0-9