Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging
Paper in proceedings, 2008

Author

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Teng Wang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging

E3-01

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017