The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish
Paper in proceeding, 2008
Author
Lili Zhang
Cristina Andersson
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Zhaonian Cheng
Proceedings of the 2nd Electronics Systemintegration Technology Conference
1295-1300
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering