Comparison of Mechanical Fatigue Test and Thermal Cycling for Failure Analysis of Solder Joints
Paper in proceeding, 2001
Author
Xitao Wang
Liu Chen
Zonghe Lai
Department of Microelectronics and Nanoscience
Johan Liu
Department of Microelectronics and Nanoscience
Proceedings of The IMAPS Nordic 38th Annual Conference
70-77
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering