Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
Paper in proceedings, 2006

Author

Si Chen

Chalmers, Microtechnology and Nanoscience (MC2)

Peng Sun

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Xiecheng Wei

Zhaonian Cheng

Dongkai Shangguan

Proceedings of the 2006 7th International Conference on Electronics Packaging Technology

368-373

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017