ZrO2 gate dielectrics prepared by e-beam deposition of Zr and YSZ films and post annealing processes
Paper i proceeding, 2002

In this paper we present the electrical performance of MOS capacitors with ZrO2 gate dielectric prepared by e-beam evaporation of zirconium and yttrium stabilized zirconia (YSZ) and subsequent thermal treatment. To this stage we have reached an equivalent oxide thickness (EOT) of 1.9 nm. The effect of post-oxidation annealing on Zr incorporation into the Si substrate is investigated. SIMS analysis showed no signs of Zr diffusion in the substrate at temperatures as high as 900°C and that significant diffusion occurs only at 1100°C

dielectric thin films

CMOS integrated circuits



integrated circuit testing

MOS capacitors



secondary ion mass spectra

zirconium compounds

electron beam deposition


Mikael Johansson

Institutionen för mikroelektronik

M. Y. A. Yousif

Institutionen för mikroelektronik

Alok Sareen

Institutionen för mikroelektronik

Per Lundgren

Institutionen för mikroelektronik

Stefan Bengtsson

Institutionen för mikroelektronik

Ulf Södervall

Institutionen för mikroelektronik och nanovetenskap

ESSDERC 2002. Proceedings of the 32nd European Solid-State Device Research Conference



Annan elektroteknik och elektronik

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