Graphene-based heat spreading materials for electronics packaging applications
Paper i proceeding, 2017

Graphene-based heat spreading materials, including graphene-based film (GBF) and graphene-based electrically conductive adhesive (G-CA), were applied to electronics packaging. The thermal performances of GBF and G-CA were analyzed by resistance temperature detector (RTD) and thermal infrared imager. When the chip was covered by GBF and G-CA, the temperature of hotspot could be reduced by 3.1°C, at heat flux of 580 W/cm2. To analyze the thermal performances of G-CA and GBF in 3D electronics packaging, the distribution of temperature and temperature profiles on the top surface of chip were analyzed by COMSOL. Both of GBF and G-CA could obviously reduce the temperature of hotspot on the top surface of chip, compared with that on the bare chip. With G-CA and GBF, the temperature of hotspot could be reduced by 8°C. It suggests that both of G-CA and GBF are good heat spreading materials for electronics packaging application.

graphene-based electrically conductive adhesive

electronics packaging

graphene-based film

heat spreading materials

Författare

G. Yuan

Shanghai University

B. Shan

Shanghai University

S. Chen

Shanghai University

Y. Yang

Shanghai University

Jie Bao

Shanghai University

Nan Wang

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Peng Su

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

S. Huang

Shanghai University

Y. Zhang

Shanghai University

L. Ye

SHT Smart High-Tech

Shanghai University

Johan Liu

Shanghai University

2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017

172-174

Ämneskategorier

Materialkemi

DOI

10.1109/NORDPAC.2017.7993187

ISBN

978-1-5386-3055-6

Mer information

Senast uppdaterat

2018-09-21