Graphene-CNT hybrid material as potential thermal solution in electronics applications
Paper i proceeding, 2017

Graphene and CNT have great potential in electronics applications. This work explored the possibility of integrating 1D CNT and 2D graphene into a 3D covalently bonded structure, i.e. a graphene-CNT hybrid material for thermal management application. The graphene-CNT hybrid material was later investigated morphologically and thermally to observe its heat dissipation capability.

Thermal Conductivity

Graphene

Thermal Management

Covalent bonding

CNT

Författare

C. C. Darmawan

SHT Smart High-Tech AB

L. Ye

SHT Smart High-Tech AB

Kabir Majid Samani

Elektronikmaterial och system

Yifeng Fu

Elektronikmaterial och system

Johan Liu

Elektronikmaterial och system

2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017

190-193

Ämneskategorier

Materialkemi

DOI

10.1109/NORDPAC.2017.7993191

ISBN

978-1-5386-3055-6