Graphene-CNT hybrid material as potential thermal solution in electronics applications
Paper i proceeding, 2017

Graphene and CNT have great potential in electronics applications. This work explored the possibility of integrating 1D CNT and 2D graphene into a 3D covalently bonded structure, i.e. a graphene-CNT hybrid material for thermal management application. The graphene-CNT hybrid material was later investigated morphologically and thermally to observe its heat dissipation capability.

Thermal Conductivity

Graphene

CNT

Thermal Management

Covalent bonding

Författare

C. C. Darmawan

SHT Smart High-Tech

L. Ye

SHT Smart High-Tech

Majid Kabiri Samani

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Yifeng Fu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Shanghai University

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

190-193

IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Göteborg, Sweden,

Ämneskategorier

Materialkemi

DOI

10.1109/NORDPAC.2017.7993191