Characterisation of InGaAs/AlAs resonant-tunnelling diodes
Poster (konferens), 2024
The RTDs used consist of two thin layers of AlAs enveloping a layer of InGaAs. Spacer layers of undoped InGaAs encase the AlAs and serve to reduce the device capacitance. Two lightly doped regions supply the charge carriers, and lastly, two heavily doped regions enable the fabrication of ohmic contacts. With coplanar waveguides connected to GSG contact pads, vertical RTDs capable of both one- and two-port on-wafer S-parameter measurements are fabricated. De-embedding structures and multiline thru-reflect-line calibration standards are also designed and fabricated on-chip. A thin film resistor is fabricated in parallel to the RTD to enable measurements in the negative differential conductance region of the RTD. Measurements are performed with and without the shunt resistor, and after de-embedding of the resistor the results are compared. We will present preliminary results of extracting RTD model parameters.
Författare
Patrik Blomberg
Chalmers, Mikroteknologi och nanovetenskap, Terahertz- och millimetervågsteknik
Josip Vukusic
Chalmers, Mikroteknologi och nanovetenskap, Terahertz- och millimetervågsteknik
Jan Stake
Chalmers, Mikroteknologi och nanovetenskap, Terahertz- och millimetervågsteknik
Lund, Sweden,
THz kommunikation - NU
Stiftelsen för Strategisk forskning (SSF) (CHI19-0027), 2021-01-01 -- 2025-12-31.
Infrastruktur
Kollberglaboratoriet
Myfab (inkl. Nanotekniklaboratoriet)
Styrkeområden
Nanovetenskap och nanoteknik
Ämneskategorier (SSIF 2025)
Nanoteknisk elektronik