Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging
Paper i proceeding, 2009
Författare
Xiuzhen Lu
Li Xu
Huaxiang Lai
Xinyu Du
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Zhaonian Cheng
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
1051-1053
Ämneskategorier
Materialteknik