Integrated MEMS-Tunable VCSELs Using a Self-Aligned Reflow Process
Journal article, 2012

A simple microelectromechanical systems technology for wafer-scale integration of tunable vertical-cavity surface-emitting lasers (VCSELs) is presented. The key element is a self-aligned reflow process to form photoresist droplets, which serve as sacrificial layer and preform for a curved micromirror. Using a 3-D electromagnetic model, the half-symmetric cavity is optimized for singlemode emission. The technology is demonstrated for electrically pumped, short-wavelength (850 nm) tunable VCSELs, but is transferable to other wavelengths and material systems. Fabricated devices with 10 mu m large current aperture are singlemode and tunable over 24 nm. An improved high-speed design with reduced parasitic capacitance enables direct modulation with 3dB-bandwidths up to 6 GHz and data transmission at 5Gbit/s. Small signal analysis shows that the intrinsic parameters (resonance frequency and damping) are wavelength dependent through the differential gain.

vertical-cavity surface-emitting laser

microlens

wafer-scale integration

micromirror

reflow

photoresist

Microelectromechanical system

laser

mode

tunable laser

tunnel-junction

Author

Benjamin Kögel

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

P. Debernardi

Consiglo Nazionale Delle Richerche

Petter Westbergh

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Johan Gustavsson

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Åsa Haglund

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Erik Haglund

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Jörgen Bengtsson

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Anders Larsson

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

IEEE Journal of Quantum Electronics

0018-9197 (ISSN)

Vol. 48 2 144-152

Subject Categories

Physical Sciences

DOI

10.1109/JQE.2011.2172191

More information

Latest update

9/6/2018 1