Impact of Bonding Interface Thickness on the Performance of Silicon-Integrated Hybrid-Cavity VCSELs
Paper in proceeding, 2016
The dependence of the performance of short-wavelength silicon-integrated hybrid-cavity VCSELs on the thickness of the bonding interface used for the heterogeneous integration has been studied. Performance measures investigated include the emission wavelength, thermal impedance, and variation of threshold current and output power with temperature.
semiconductor lasers
Heterogeneous integration
vertical-cavity surface-emitting laser (VCSEL)
silicon photonics
Author
Emanuel Haglund
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Sulakshna Kumari
Ghent university
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Erik Haglund
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Johan Gustavsson
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Roel G. Baets
Ghent university
Gunther Roelkens
Ghent university
Anders Larsson
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Conference Digest - IEEE International Semiconductor Laser Conference
08999406 (ISSN)
Article no 7765752- 7765752978-4-8855-2306-9 (ISBN)
Areas of Advance
Information and Communication Technology
Nanoscience and Nanotechnology
Subject Categories
Telecommunications
Infrastructure
Nanofabrication Laboratory
ISBN
978-4-8855-2306-9