High speed optical interconnects with 850 nm VCSELs and advanced modulation formats
Paper in proceeding, 2017
Vertical-cavity surface-emitting laser
Optical interconnect
Multilevel modulation
PAM
Author
Krzysztof Szczerba
Finisar Corporation
Tamas Lengyel
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Zhongxia Simon He
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Jingjing Chen
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Peter Andrekson
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Magnus Karlsson
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Herbert Zirath
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Anders Larsson
Chalmers, Microtechnology and Nanoscience (MC2), Photonics
Proceedings of SPIE - The International Society for Optical Engineering
0277786X (ISSN) 1996756X (eISSN)
Vol. 10122 101220GSan Francisco, CA, USA,
Subject Categories
Telecommunications
DOI
10.1117/12.2256992