The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder
Paper in proceedings, 2009

Author

Zhaonian Cheng

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yulai Gao

Qijie Zhai

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

1240-1245

Subject Categories

Materials Engineering

More information

Created

10/8/2017