The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder
Paper i proceeding, 2009
Författare
Si Chen
Zhaonian Cheng
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Yulai Gao
Qijie Zhai
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
1240-1245
Ämneskategorier
Materialteknik