Wafer bonding for MEMS
Paper in proceedings, 2005

Author

Peter Enoksson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Cristina Rusu

Anke Sanz-Velasco

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Martin Bring

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Alexandra Nafari

Chalmers, Microtechnology and Nanoscience (MC2)

Stefan Bengtsson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceeding of the 9th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applic, Canadaations, Quebec City

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017