Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications
Journal article, 2014

With increased power density and continued miniaturization, effective thermal dissipation is of significant importance for operational lifetime and reliability of electronic system. Advanced thermal interface materials (TIMs) with excellent thermal performance need to be designed and developed. Here we report novel TIMs consisted of boron nitride (BN) nanofibers and pure indium (In) solder for heat dissipation applications. The BN nanofibers are fabricated by electrospinning process and nitridation treatment. After surface metallization by sputtering, the porous BN film is infiltrated with liquid indium by squeeze casting to form the final solid composites. The new composites show the in-plane and through-plane thermal conductivity respectively of 60 and 20 W/m K. The direction dependence thermal properties of the TIM are due to the anisotropic thermal performance of BN nanofibers in the composite. A low thermal contact resistance of 0.2 K mm(2)/W is also achieved at the interface between this new composite and copper substrate. These competent thermal properties demonstrate the great potential of the BN-In TIMs in thermal management for electronic system.

CONDUCTIVITY

THIN

DEFORMATION

LASER-ABLATION

FILMS

OXIDE

SOLDER JOINTS

Author

Xin Luo

Chalmers, Applied Physics, Electronics Material and Systems

Yong Zhang

Chalmers, Applied Physics, Electronics Material and Systems

Carl Zandén

Chalmers, Applied Physics, Electronics Material and Systems

Murali Murugesan

Chalmers, Applied Physics, Electronics Material and Systems

Yu Cao

Chalmers, Materials and Manufacturing Technology, Surface and Microstructure Engineering

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Journal of Materials Science: Materials in Electronics

0957-4522 (ISSN) 1573-482X (eISSN)

Vol. 25 5 2333-2338

Subject Categories

Materials Engineering

DOI

10.1007/s10854-014-1880-8

More information

Latest update

3/7/2018 7