Nanostructured Polymer-metal Composite for Thermal Interface Material Applications
Paper in proceeding, 2008
Author
Björn Carlberg
Chalmers, Applied Physics, Electronics Material and Systems
Teng Wang
Chalmers, Applied Physics, Electronics Material and Systems
Yifeng Fu
Chalmers, Applied Physics, Electronics Material and Systems
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Dongkai Shangguan
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC)
191-197
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering