VCSEL and Integration Techniques for Wavelength-Multiplexed Optical Interconnects

Doktorsavhandling, 2021

GaAs-based vertical-cavity surface-emitting lasers (VCSELs) are dominating short-reach optical interconnects (OIs) due to their high modulation speed, low power consumption, circular output beam and low fabrication cost. Such OIs provide the high bandwidth connectivity needed for interconnecting servers and switches in data centers. With the rapidly increasing use of Internet-based applications and services, higher bandwidth connectivity and higher aggregate capacity VCSEL-based OIs are needed. Until now, this has been achieved mostly through an increase of the lane rate by higher speed VCSELs and higher order modulation formats. Furthermore, spatial-division-multiplexing has proven effective for increasing the aggregate capacity. Much higher capacity can be achieved by multiple wavelengths per fiber, known as wavelength-divisionmultiplexing (WDM). Moreover, smaller footprint and higher bandwidth density WDM transceivers can be built using monolithic multi-wavelength VCSEL arrays with densely spaced VCSELs. This requires a VCSEL technology where the wavelength of individual VCSELs can be precisely set in a post-epitaxial growth fabrication process and a photonic integrated circuit (PIC) for multiplexing and fiber coupling. Flip-chip integration over grating couplers (GCs) is considered for interfacing VCSELs with waveguides on the PIC.

In this thesis, an intra-cavity phase tuning technique is demonstrated for setting the resonance wavelength of VCSELs in a monolithic array with an accuracy in spacing of <1 nm. Uniform performance over the array is achieved by spectral matching and balancing of mirror reflectances, optical confinement factor and optical gain. Single transverse and polarization mode VCSELs, as required for flip-chip integration over GCs, with a record output power of 6 mW are also demonstrated.

Finally, an investigation of angled flip-chip integration of a VCSEL over a GC on a silicon photonic integrated circuit (Si-PIC) is presented. Dependencies of coupling efficiency and optical feedback on flip-chip angle and size of the VCSEL die are studied using numerical FDTD simulations. Moreover, flip-chip integration of a VCSEL over a GC on a Si-PIC is experimentally demonstrated. The insertion loss from the VCSEL at the input GC to a singlemode fiber, multimode fiber or flip-chip integrated photodetector over the output GC was measured and quantified. The latter forms an on-PIC optical link.