Fabrication and development of InP HEMTs on silicon substrate based on a new integration technique
Paper i proceeding, 2026
Current methods for transferring III-V technology onto silicon are based on wafer bonding techniques. Here we explore fabrication applicability of traditional InP-based High Electron Mobility Transistors (InP HEMTs) on InP-on-Si (InPoSi) wafers developed by Smart Cut, a method for transferring InP onto Si that reduces cost and fabrication complexity. We fabricated 100-nm gate length InP HEMTs, including test structures and Hall bars on both InPoSi and InP wafers. Transfer Length Method (TLM) measurements for InPoSi and InP bulk wafers showed comparable contact and sheet resistances. These preliminary results show that InP HEMTs can be fabricated on InPoSi.
Hall Bar
Silicon Substrate
Metal Organic Chemical Vapor Deposition
InP High Electron Mobility Transistors
Integration Of Techniques
High Electron Mobility Transistors
Electron Beam Lithography
Sheet Resistance
III-V semiconductor materials
Fabrication Process
Contact Resistance
Författare
Francesco Fortunato
Chalmers, Mikroteknologi och nanovetenskap, Terahertz- och millimetervågsteknik
Nelson Rebelo
Low Noise Factory AB
Claire Besancon
III-V Lab
Florence Martin
III-V Lab
Bruno Ghyselen
Soitec SA
Jean Decobert
III-V Lab
Johan Bergsten
Low Noise Factory AB
Helena Rodilla
Chalmers, Mikroteknologi och nanovetenskap, Terahertz- och millimetervågsteknik
International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz
21622027 (ISSN) 21622035 (eISSN)
979-8-3503-7883-2 (ISBN)
2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
Helsinki, Finland,
Helsinki, Finland,
Chips JU 2023 RIA Move2THz
VINNOVA (2024-00556), 2024-06-01 -- 2027-05-30.
Sustainable Indium Phosphide (InP) platform and ecosystem upscaling, enabling future mass market (sub-)THz applications (Move2THz)
Europeiska kommissionen (EU) (EC/HE/101139842), 2024-05-01 -- 2027-04-30.
Styrkeområden
Informations- och kommunikationsteknik
Nanovetenskap och nanoteknik
Infrastruktur
Kollberglaboratoriet
Myfab (inkl. Nanotekniklaboratoriet)
Ämneskategorier (SSIF 2025)
Annan elektroteknik och elektronik
Nanoteknisk elektronik
DOI
10.1109/IRMMW-THz61557.2025.11320086