On-Chip Sensors for Temperature Monitoring of Packaged GaN MMICs
Artikel i vetenskaplig tidskrift, 2024

A novel approach to on-chip temperature sensors for non-invasive thermal characterization and monitoring of packaged GaN MMICs is presented. The proposed sensor is fully compatible with commercial GaN foundry processes and enables improved reliability estimation of highly integrated systems. A dedicated test structure is developed to demonstrate the capabilities of the sensor, and an accurate calibration method of its temperature response is proposed. This combination allows for continuous temperature monitoring during operation with electrical acquisition of temperature transients. The method also enables the thermal characterization of the device and package.

Resistors

Electro-thermal effects

MMIC

Semiconductor device packaging

Sensors

Monitoring

Temperature measurement

MODFETs

Temperature sensors

GaN

Thermal sensors

Sensor phenomena and characterization

Författare

Andreas Divinyi

Saab

Torbjörn M.J. Nilsson

Saab

Niklas Rorsman

Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik

Tobias Kristensen

Chalmers, Mikroteknologi och nanovetenskap, Mikrovågselektronik

Harald Hultin

Saab

Sten Gunnarsson

Saab

Mattias Thorsell

Saab

IEEE Transactions on Components, Packaging and Manufacturing Technology

2156-3950 (ISSN) 21563985 (eISSN)

Vol. 14 5 891-896

Ämneskategorier

Robotteknik och automation

Annan elektroteknik och elektronik

DOI

10.1109/TCPMT.2024.3387736

Mer information

Senast uppdaterat

2024-06-08