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Wei Mu

Showing 21 publications

2018

Understanding noninvasive charge transfer doping of graphene: a comparative study

Ankit Nalin Mehta, Wei Mu, Murali Murugesan et al

Journal of Materials Science: Materials in Electronics (7), p. 5239-5252

Journal article

2016

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Shuangxi Sun, Wei Mu, Michael Edwards et al

Nanotechnology (33), p. Art no335705-undefined

Journal article

2016

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Di Jiang, Nan Wang, Michael Edwards et al

Small (11), p. 1521-1526

Journal article

2016

Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, J. C. Peng, Carl Zandén et al

Acta Materialia, p. 109-118

Journal article

2016

3D Integration of Carbon Based Electronics

Wei Mu

Doctoral thesis

2016

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

Yifeng Fu, Wei Mu, Shuangxi Sun et al

2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764713-undefined

Paper in proceeding

2016

Carbon nanotube growth on different underlayers for thermal interface material application

Yifeng Fu, Shuangxi Sun, Wei Mu et al

IMAPS Nordic Annual Conference 2016 Proceedings

Paper in proceeding

2016

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Wei Mu, Josef Hansson, Shuangxi Sun et al

Proceedings - Electronic Components and Technology Conference, p. 211-216

Paper in proceeding

2016

Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives

Nan Wang, Nikolaos Logothetis, Wei Mu et al

2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764682-undefined

Paper in proceeding

2016

Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Wei Mu, Eun-Hye Kwak, Bingan Chen et al

Electronic Materials Letters (3), p. 329-337

Journal article

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