Sub-10 nm resolution after lift-off using HSQ./PMMA double layer resist
Journal article, 2013

Hydrogen silesquioxan (HSQ) is a well-investigated negative tone inorganic resist [1,2] which is known for its capabilities for high resolution electron beam lithography (EBL) and its stability against dry etching [3]. In this paper, we introduce a process to create dense structures by EBL utilizing a layer of polymethyl-methacrylate (PMMA) as sacrificial layer beneath a HSQ layer. The sacrificial layer allows a simple lift-off process to remove the HSQ with organic solvents and thus avoids the use of hydrofluoric acid (HF) containing etchants, which is the commonly used HSQ remover [4]. The described double layer resist system allows patterning on substrates that are not HF compatible such as glass or oxide compounds, achieving a high resolution down to the sub-10 nm regime. Despite the use of a double layer resist, this process is applicable for arbitrarily large areas due to the remaining PMMA underneath the HSQ and the avoidance of undercuts.

Electron beam lithography

HSQJPMMA double layer resist

Sub-10 nm resolution

HF free lift-off

Plasmonics

Author

Marcus Rommel

Max Planck Institute

Bengt Nilsson

Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory

Piotr Jedrasik

Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory

Valentina Bonanni

Chalmers, Applied Physics, Bionanophotonics

Alexander Dmitriev

Chalmers, Applied Physics, Bionanophotonics

Juergen Weis

Max Planck Institute

Microelectronic Engineering

0167-9317 (ISSN)

Vol. 110 123-125

Subject Categories

Nano Technology

DOI

10.1016/j.mee.2013.02.101

More information

Latest update

2/21/2018