Building blocks of a flip-chip integrated superconducting quantum processor
Journal article, 2022
We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips-one quantum chip and one control chip-that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 mu s, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.
coherence times
gate fidelities
superconducting qubit
transmon
design and simulation
flip-chip integration
Author
Sandoko Kosen
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Hangxi Li
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Marcus Rommel
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
Daryoush Shiri
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Christopher Warren
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Leif Gronberg
Technical Research Centre of Finland (VTT)
Jaakko Salonen
Technical Research Centre of Finland (VTT)
Tahereh Abad
Chalmers, Microtechnology and Nanoscience (MC2), Applied Quantum Physics
Janka Biznárová
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Marco Caputo
Technical Research Centre of Finland (VTT)
Liangyu Chen
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Kestutis Grigoras
Technical Research Centre of Finland (VTT)
Göran Johansson
Chalmers, Microtechnology and Nanoscience (MC2), Applied Quantum Physics
Anton Frisk Kockum
Chalmers, Microtechnology and Nanoscience (MC2), Applied Quantum Physics
Christian Krizan
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Daniel Perez Lozano
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Graham J. Norris
Swiss Federal Institute of Technology in Zürich (ETH)
Amr Osman
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Jorge Fernández-Pendás
Chalmers, Microtechnology and Nanoscience (MC2), Applied Quantum Physics
Alberto Ronzani
Technical Research Centre of Finland (VTT)
Anita Fadavi Roudsari
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Slawomir Simbierowicz
Technical Research Centre of Finland (VTT)
Bluefors Cryogenics OY
Giovanna Tancredi
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Andreas Wollraff
Swiss Federal Institute of Technology in Zürich (ETH)
Christopher Eichler
Swiss Federal Institute of Technology in Zürich (ETH)
Joonas Govenius
Technical Research Centre of Finland (VTT)
Jonas Bylander
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Quantum Science and Technology
20589565 (eISSN)
Vol. 7 3 035018An Open Superconducting Quantum Computer (OpenSuperQ)
European Commission (EC) (EC/H2020/820363), 2018-10-01 -- 2021-09-30.
Subject Categories
Computer Engineering
Control Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
Driving Forces
Sustainable development
Innovation and entrepreneurship
Areas of Advance
Nanoscience and Nanotechnology
Materials Science
Roots
Basic sciences
DOI
10.1088/2058-9565/ac734b