Trapping Effects in Gallium Nitride High Electron Mobility Transistors: Mechanisms, Modeling, and Applications
Doctoral thesis, 2025

While GaN-based high electron mobility transistors (HEMTs) have become indispensable for 5G and RADAR systems and shown potential for astronomy and space exploration. Knowledge gaps remain in how epitaxial and processing design impact device performance. Downscaling of GaN HEMTs exacerbates source-drain current dispersion due to trapping and self-heating effects. This thesis focuses on characterizing and optimizing back-barrier/buffer design and processing methods to mitigate trap-induced degradation.

Although back-barrier and buffer doping individually enhance two-dimensional electron gas (2DEG) confinement, carbon-induced trapping creates a trade-off between confinement and dispersion. This work explores variations in carbon doping levels in the GaN buffer and AlGaN back-barrier to improve 2DEG confinement. By employing extensive electrical and spectroscopic methods, trapping mechanisms and their origins are investigated. The results show that dispersion dominates over short-channel effects at the investigated carbon levels, offering guidance for RF performance optimization. Annealing during gate opening is widely used to counteract damage from fluorinebased plasma treatments. However, the influence of high-temperature pre-gate annealing (500−800◦C), particularly in relation to CF4 and CF4 chemistries, remains underexplored. This study demonstrates that fluorine implantation and surface oxidation affect device behavior via thermally activated and deactivated traps. It identifies optimal combinations of fluorine plasma and annealing treatments, showing that up to 60 % of CF4 plasma-induced F−states can be deactivated by 600◦C annealing. Buffer trapping is also studied under cryogenic conditions, where Fe-induced traps manifest slow de-trapping dynamics. Field plates are found to mitigate these effects, emphasizing epi-structure and layout design strategies critical for reliable cryogenic GaN HEMT operation.

This thesis further shows that charged states introduced during gate-defining processing can be deliberately harnessed to modulate reverse gate-bias C–V characteristics. By varying fluorine plasma chemistry and pre-gate annealing conditions, the distribution and concentration of charged states in the barrier/channel region can be tuned. This enables the development of GaN-based varactors for MMIC applications, offering low nonlinear distortion in RF systems. By addressing key challenges in reliability and performance, and exploring emerging applications such as cryogenic operation and varactor integration. This thesis is well placed to advance and diversify GaN HEMT technology.

downscaling

HEMT

RF

Trapping effects

AlGaN/GaN

characterization

GaN varactor

Kollektorn MC2
Opponent: Stephane Piotrowicz, Dr. and Researcher, III-V Lab

Author

Ragnar Ferrand-Drake Del Castillo

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Cryogenic Trapping Effects in GaN-HEMTs: Influences of Fe-Doped Buffer and Field Plates

IEEE Transactions on Electron Devices,;Vol. 72(2025)p. 4042-4048

Journal article

Characterization of Trapping Effects Related to Carbon Doping Level in AlGaN Back-Barriers for AlGaN/GaN HEMTs

IEEE Transactions on Electron Devices,;Vol. 71(2024)p. 3596-3602

Journal article

GaN High-Electron-Mobility Transistors with Superconducting Nb Gates for Low-Noise Cryogenic Applications

Physica Status Solidi (A) Applications and Materials Science,;Vol. 220(2023)

Journal article

Noise Characterization and Modeling of GaN-HEMTs at Cryogenic Temperatures

IEEE Transactions on Microwave Theory and Techniques,;Vol. 71(2023)p. 1923-1931

Journal article

Comparison of the low noise performance of GaN HEMTs and MIS-HEMTs at cryogenic temperatures

2023 18th European Microwave Integrated Circuits Conference, EuMIC 2023,;(2023)p. 29-32

Paper in proceeding

A Cryogenic Scalable Small-Signal & Noise Model of GaN HEMTs

32nd International Symposium of Space Terahertz Technology, ISSTT 2022,;(2022)

Paper in proceeding

GaN HEMT with superconducting Nb gates for low noise cryogenic applications

2022 Compound Semiconductor Week, CSW 2022,;(2022)

Paper in proceeding

Considerations in the development of a gate process module for ultra-scaled GaN HEMTs

2022 Compound Semiconductor Week, CSW 2022,;(2022)

Paper in proceeding

R. Ferrand-Drake del Castillo, V. Darakchieva, and N. Rorsman, "Effects of Fluorine-Based Plasma Etching and Pre-Gate Annealing on AlGaN/GaN HEMT Characteristics," IEEE Transactions on Electron Devices, Submitted: 2025/04/07

R. Ferrand-Drake del Castillo, B. Hult, M. Thorsell, and N. Rorsman, "Linear C–V Characteristics in GaN HEMT Varactors by Fluorine Plasma-Enhanced Gate Engineering," IEEE Electron Device Letters, Submitted: 2025/08/11

Gallium Nitride (GaN) high electron mobility transistors (HEMTs) are essential for advanced RF technologies such as 5G, radar, space communication, and radio astronomy, offering high power, efficiency, and robustness. However, their performance can be severely degraded by charge trapping effects, which cause current collapse, reduced efficiency, and instability.
This thesis investigates the physical mechanisms, material origins, and processing influences behind trapping in high frequency GaN HEMTs. Through systematic studies of epitaxial design, particularly carbon-doped back-barriers and buffers, alongside fluorine-based gate processing and high-temperature annealing, strategies are developed to minimize trap-induced degradation. Cryogenic trapping effects in Fe-doped buffers are analyzed, revealing mitigation routes via field-plate engineering.
Beyond suppression, the work also demonstrates how controlled introduction of charge states can be harnessed to create GaN-based varactors with highly linear capacitance–voltage characteristics, enabling integration into MMIC architectures with minimal added complexity.
By combining electrical and spectroscopic characterization with targeted design and processing optimizations, this research provides practical pathways to enhance RF performance, reliability, and integration potential of GaN HEMTs across emerging high-frequency and extreme-environment applications.

Avancerade GaN-komponenter för mm och sub-mmvågs kommunikation

Swedish Foundation for Strategic Research (SSF) (STP19-0008), 2020-06-01 -- 2025-05-31.

Areas of Advance

Nanoscience and Nanotechnology

Subject Categories (SSIF 2025)

Nanotechnology for Electronic Applications

Electrical Engineering, Electronic Engineering, Information Engineering

ISBN

978-91-8103-270-3

Doktorsavhandlingar vid Chalmers tekniska högskola. Ny serie: 5728

Publisher

Chalmers

Kollektorn MC2

Online

Opponent: Stephane Piotrowicz, Dr. and Researcher, III-V Lab

More information

Latest update

8/27/2025