Building blocks of a flip-chip integrated superconducting quantum processor
Journal article, 2022

We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips-one quantum chip and one control chip-that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 mu s, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.

coherence times

gate fidelities

superconducting qubit

transmon

design and simulation

flip-chip integration

Author

Sandoko Kosen

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Hangxi Li

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Marcus Rommel

Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory

Daryoush Shiri

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Christopher Warren

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Leif Gronberg

Technical Research Centre of Finland (VTT)

Jaakko Salonen

Technical Research Centre of Finland (VTT)

Tahereh Abad

Chalmers, Microtechnology and Nanoscience (MC2), Applied Quantum Physics

Janka Biznárová

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Marco Caputo

Technical Research Centre of Finland (VTT)

Liangyu Chen

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Kestutis Grigoras

Technical Research Centre of Finland (VTT)

Göran Johansson

Chalmers, Microtechnology and Nanoscience (MC2), Applied Quantum Physics

Anton Frisk Kockum

Chalmers, Microtechnology and Nanoscience (MC2), Applied Quantum Physics

Christian Krizan

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Daniel Perez Lozano

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Graham J. Norris

Swiss Federal Institute of Technology in Zürich (ETH)

Amr Osman

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Jorge Fernández-Pendás

Chalmers, Microtechnology and Nanoscience (MC2), Applied Quantum Physics

Alberto Ronzani

Technical Research Centre of Finland (VTT)

Anita Fadavi Roudsari

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Slawomir Simbierowicz

Technical Research Centre of Finland (VTT)

Bluefors Cryogenics OY

Giovanna Tancredi

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

Andreas Wollraff

Swiss Federal Institute of Technology in Zürich (ETH)

Christopher Eichler

Swiss Federal Institute of Technology in Zürich (ETH)

Joonas Govenius

Technical Research Centre of Finland (VTT)

Jonas Bylander

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology

QUANTUM SCIENCE AND TECHNOLOGY

2058-9565 (ISSN)

Vol. 7 3 035018

An Open Superconducting Quantum Computer (OpenSuperQ)

European Commission (EC) (EC/H2020/820363), 2018-10-01 -- 2021-09-30.

Subject Categories

Computer Engineering

Control Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering

Driving Forces

Sustainable development

Innovation and entrepreneurship

Areas of Advance

Nanoscience and Nanotechnology (SO 2010-2017, EI 2018-)

Materials Science

Roots

Basic sciences

DOI

10.1088/2058-9565/ac734b

More information

Latest update

6/28/2022