Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity
Paper in proceedings, 2005

Author

Peng Sun

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Cristina Andersson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Xicheng Wei

Zhaonian Cheng

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)

pp197-202

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017