Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity
Paper in proceeding, 2005
Author
Peng Sun
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Cristina Andersson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Zonghe Lai
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Xicheng Wei
Zhaonian Cheng
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)
pp197-202
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering