Analysis of Thermal Effects in Integrated Radio Transmitters
Paper i proceeding, 2018

The combination of compact size and low efficiency at mm-waves has turned heat dissipation into a fundamental constraint for design of multi-antenna radios. This paper describes methods for analysis of thermal effects at both at the circuit, system and component level. The first part describes how thermal analysis can be combined with advanced RF modeling techniques to predict self-heating and thermal coupling in multi-antenna transmitter systems. Experimental methods are then used to determine thermal coupling effects occurring at chip level. Various experimental and theoretical results, using MIMO amplifiers and GaN HEMTs, are used to demonstrate the methods in realistic application scenarios.

Författare

Christian Fager

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Mattias Thorsell

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Emanuel Baptista

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Koen Buisman

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Johan Bremer

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Johan Bergsten

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Niklas Rorsman

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

2018 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA)

1930-8868 (ISSN)

International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)
Hsinchu, Taiwan,

Ämneskategorier

Energiteknik

Inbäddad systemteknik

Annan elektroteknik och elektronik

DOI

10.1109/VLSI-TSA.2018.8403800

ISBN

9781538648254

Mer information

Senast uppdaterat

2019-01-17