Analysis of Thermal Effects in Integrated Radio Transmitters
Paper in proceedings, 2018

The combination of compact size and low efficiency at mm-waves has turned heat dissipation into a fundamental constraint for design of multi-antenna radios. This paper describes methods for analysis of thermal effects at both at the circuit, system and component level. The first part describes how thermal analysis can be combined with advanced RF modeling techniques to predict self-heating and thermal coupling in multi-antenna transmitter systems. Experimental methods are then used to determine thermal coupling effects occurring at chip level. Various experimental and theoretical results, using MIMO amplifiers and GaN HEMTs, are used to demonstrate the methods in realistic application scenarios.

Author

Christian Fager

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Mattias Thorsell

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Emanuel Baptista

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Koen Buisman

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Johan Bremer

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Johan Bergsten

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Niklas Rorsman

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

2018 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA)

1930-8868 (ISSN)

International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)
Hsinchu, Taiwan,

Subject Categories

Energy Engineering

Embedded Systems

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/VLSI-TSA.2018.8403800

ISBN

9781538648254

More information

Latest update

1/17/2019