Analysis of Lateral Thermal Coupling for GaN MMIC Technologies
Journal article, 2018
heat spread
lateral coupling
Gallium nitride (GaN)
semiconductor resistor
thermal sensors
Author
Johan Bremer
GigaHertz Centre
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Johan Bergsten
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Lowisa Hanning
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Torbjörn Nilsson
Saab
Niklas Rorsman
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Sebastian Gustafsson
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Martin Eriksson
Chalmers, Physics, Condensed Matter Theory
Mattias Thorsell
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
GigaHertz Centre
IEEE Transactions on Microwave Theory and Techniques
0018-9480 (ISSN) 15579670 (eISSN)
Vol. 66 10 4430-4438 8409464Subject Categories
Energy Engineering
Other Engineering and Technologies not elsewhere specified
Other Electrical Engineering, Electronic Engineering, Information Engineering
Infrastructure
Nanofabrication Laboratory
DOI
10.1109/TMTT.2018.2848932