Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects
Paper in proceedings, 2016
Author
Wei Mu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Josef Hansson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Shuangxi Sun
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Michael Edwards
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Kjell Jeppson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 31-Jun 03, 2016
0569-5503 (ISSN)
211-216Areas of Advance
Production
Subject Categories
Nano Technology
DOI
10.1109/ECTC.2016.160
ISBN
978-1-5090-1204-6