A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
Journal article, 2017
flexible electronics
carbon nanotubes
interconnect
3D integration
Author
Di Jiang
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Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Shuangxi Sun
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Michael Edwards
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
IDEX Biometrics UK Ltd
Kjell Jeppson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Nan Wang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Flexible and Printed Electronics
2058-8585 (ISSN)
Vol. 2 2 025003Areas of Advance
Production
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1088/2058-8585/aa6a82