Piotr Starski

Professor Emeritus at Terahertz and Millimetre Wave Laboratory

Source: chalmers.se

Contact Details

Publications (28)
Projects (0)

Showing 28 publications

2017

Two-Finger InP HEMT Design for Stable Cryogenic Operation of Ultra-Low-Noise Ka- and Q-Band LNAs

Eunjung Cha, Giuseppe Moschetti, Niklas Wadefalk et al

IEEE Transactions on Microwave Theory and Techniques. Vol. 65 (12), p. 5171-5180

Journal article

2017

Two-finger InP HEMT design for stable cryogenic operation of ultra-low-noise Ka-band LNAs

Eunjung Cha, Giuseppe Moschetti, Niklas Wadefalk et al

IEEE MTT-S International Microwave Symposium Digest, p. 168-171

Paper in proceeding

2016

Cryogenic Low Noise Amplifiers in an InP HEMT MMIC Process

Per-Åke Nilsson, Arsalan Pourkabirian, Joel Schleeh et al

Asia-Pacific Microwave Conference, APMC 2015, Nanjing, China, 6-9 December 2015. Vol. 1, p. Art. no. 7411746-

Paper in proceeding

2016

Cryogenic low-noise InP HEMTs: A source-drain distance study

Eunjung Cha, Arsalan Pourkabirian, Joel Schleeh et al

2016 Compound Semiconductor Week, CSW 2016, p. Article number 7528576-

Paper in proceeding

2014

An InP MMIC process optimized for low noise at Cryo

Per-Åke Nilsson, Joel Schleeh, Niklas Wadefalk et al

Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC

Paper in proceeding

2013

Cryogenic Broadband Ultra-Low-Noise MMIC LNAs for Radio Astronomy Applications

Joel Schleeh, Niklas Wadefalk, Per-Åke Nilsson et al

IEEE Transactions on Microwave Theory and Techniques. Vol. 61 (2), p. 871-877

Journal article

2012

Cryogenic 0.5-13 GHz low noise amplifier with 3 K mid-band noise temperature

Joel Schleeh, Niklas Wadefalk, Per-Åke Nilsson et al

IEEE MTT-S International Microwave Symposium Digest

Paper in proceeding

2012

Ultralow-Power Cryogenic InP HEMT With Minimum Noise Temperature of 1 K at 6 GHz

Joel Schleeh, Göran Alestig, John Halonen et al

IEEE Electron Device Letters. Vol. 33 (5), p. 664-666

Journal article

2007

60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects

W.-C. Wu, L.-H. Hsu, E.Y. Chang et al

Microwave and Wireless Components Letters, IEEE. Vol. 17 (11, Nov. 2007), p. 784-786

Journal article

2007

Coaxial transitions for CPW-to-CPW flip chip interconnects

W. C. Wu, E. Y. Chang, C. H. Huang et al

Electronics Letters. Vol. 43 (17, Aug. 16), p. 929-930

Journal article

2007

Cryogenic X-Band Low Noise Amplifiers

Naiara Goia, Matthew Kelly, Anna Malmros et al

4th ESA International Workshop on Tracking, Telemetry & Command Systems for Space Applications

Paper in proceeding

2007

60 GHz broadband 0=1-level RF-via interconnect for RF-MEMS packaging

W.C. Wu, L. H. Hsu, E. Y. Chang et al

Electronics Letters. Vol. 43 (22, Oct. 25)

Journal article

2006

Investigation of Parylene-C on the performance of millimeter-wave circuits

Camilla Kärnfelt, Christina Tegnander, Janusz Rudnicki et al

IEEE Transactions on Microwave Theory and Techniques. Vol. 54 (8), p. 3417-3425

Journal article

2006

A comparison of cryogenically cooled pseudomorphic and lattice matched InP HEMTs: Implementation in an ultra-low noise amplifier

Anna Malmros, Niklas Wadefalk, Piotr Starski et al

Asia Pacific Microwave Conference

Paper in proceeding

2006

Noise optimization of InP HEMTs

Mikael Malmkvist, Anna Malmros, Niklas Wadefalk et al

Proc. European Workshop on Compound Semiconductor Devices and Integrated Circuits, p. 97-99

Paper in proceeding

2006

Novel devices for (sub)millimeter-wave space applications

Jan Grahn, Piotr Starski, Jan Stake et al

IEICE Trans. Electronics. Vol. E89 (C(7)), p. 891-897

Journal article

2005

Flip chip assembly of a commersial MMIC amplifier on thin film alumina with electroplated pillars

Camilla Kärnfelt, Christina Tegnander, Piotr Starski et al

Proceedings of GigaHertz 2005. Vol. 1 (1), p. 234-237

Other conference contribution

2005

Fabrication of InP HEMTs for cryogenically cooled low noise amplifiers

Anna Malmros, Piotr Starski, Jan Grahn

Proceed. GigaHertz 2005 conference, p. 266-269

Other conference contribution

2005

4-8 GHz Low Noise Amplifier using Metamorphic HEMT Technology

Matthew Kelly, Iltcho Angelov, Piotr Starski et al

Gigahertz 2005

Other conference contribution

2005

InGaAs-InAlAs-InP HEMT technology for ultra-high frequency and ultra-low noise performance

Jan Grahn, Piotr Starski, Mikael Malmkvist et al

Proceed. of Conf on InP and Related Materials (IPRM'05), p. 124-128

Paper in proceeding

2005

Crygenically Cooled 8.4-8.5 GHz Low Noise Amplifiers

Naiara Goia, Matthew Kelly, Anna Malmros et al

Gigahertz 2005

Other conference contribution

2004

Cryogenic 2--4 GHz ultra low noise amplifier

Anders Mellberg, Niklas Wadefalk, Iltcho Angelov et al

IEEE MTT-S International Microwave Symposium Digest, p. 161-163

Paper in proceeding

2004

Flip Chip Assembly of a 40-60 GHz GaAs Microstrip Amplifier

Camilla Kärnfelt, Herbert Zirath, Piotr Starski et al

Proceedings of 34th European Microwave Conference. Vol. 1 (1), p. 89-92

Other conference contribution

2004

Simulations, measurements and equivalent circuit for a CPW-CPW vertical interconnection

Janusz Rudnicki, Camilla Kärnfelt, Piotr Starski

International conference on Microwaves, Radar and Wireless Communications. Vol. 2 (1), p. 682-685

Other conference contribution

2004

GaAs Flip Chip Evaluation in the 3 to 110 GHz Range

Camilla Kärnfelt, Janusz Rudnicki, Piotr Starski et al

Proceedings 3rd European Microelectronics and Packaging Symposium. Vol. 1 (1), p. 181-186

Other conference contribution

2004

Processing of RF-MEMS Switches

Ros-Marie Lundh, Yangjian Chen, Shimul Chandra Saha et al

MEMSWAVE, June 30-July 2, 2004, Uppsala, Sweden

Paper in proceeding

2002

High frequency characteristics of Liquid Crystal Polymer for System in a Package Application

Gang Zou, Hans Grönqvist, Piotr Starski et al

2002 8th International Advanced Packaging Materials Symposium, p. 337-341

Paper in proceeding

2002

Characterization of Liquid Crystal Polymer for High Frequency System-in-a-Package Applications

Gang Zou, Hans Grönqvist, Piotr Starski et al

IEEE CPMT Transactions, Part B. Vol. 25, p. 503-508

Journal article

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