Cristina Andersson

Chief Resource Officer at MC2 Operations Support

Source: chalmers.se

Contact Details

Publications (52)
Projects (0)

Showing 52 publications

2011

Reliability of Microtechnology – Interconnects, Devices and Systems

Johan Liu, Olli Salmela, Jussi Särkkä et al

Book

2009

Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate

Xia Zhang, Dan Kuylenstierna, Johan Liu et al

Journal of Infrared, Millimeter, and Terahertz Waves. Vol. 30 (2), p. 183-189

Journal article

2009

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Xiangdong Zou, Yulai Gao, Qijie Zhai et al

Journal of Electronic Materials. Vol. 38 (2), p. 351-355

Journal article

2009

Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

Cristina Andersson, B. Vandevelde, C. Noritake et al

Soldering and Surface Mount Technology. Vol. 21 (2), p. 28-38

Journal article

2009

Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles

C.-D. Zou, Y.-L. Gao, B. Yang et al

Soldering and Surface Mount Technology. Vol. 21 (2), p. 9-13

Journal article

2008

Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications

Cristina Andersson, Peng Sun, Johan Liu

Journal of Alloys and Compounds. Vol. 457 (1/2), p. 97-105

Journal article

2008

Overview of Carbon Nanotubes as Off-Chip Interconnects

Xia Zhang, Teng Wang, Johan Liu et al

Proceedings of the 2nd Electronics Systemintegration Technology Conference

Paper in proceeding

2008

Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

Johan Liu, Teng Wang, Björn Carlberg et al

Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, p. 33-47

Book chapter

2008

The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish

Lili Zhang, Cristina Andersson, Johan Liu et al

Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1295-1300

Paper in proceeding

2008

Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al

Microelectronics Reliability. Vol. 47, p. 266-272

Journal article

2008

Thermal cycling aging effect on the shear strength, microstructure, IMC and initiation and propagation of surface mounted Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components

Cristina Andersson, Per-Erik Tegehall, Dag R. Andersson et al

IEEE Transactions on Components and Packaging Technologies. Vol. 31 (2), p. 331-344

Journal article

2008

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Xiangdong Zou, Yulai Gao, Qijie Zhai et al

Journal of Electronics Materials

Journal article

2008

A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates

Xia Zhang, Dan Kuylenstierna, Johan Liu et al

Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 163-167

Paper in proceeding

2008

Recent Advances in the Synthesis of Lead-free Solder Nanoparticle

Cristina Andersson, Changdong Zou, Bin Yang et al

Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 915-922

Paper in proceeding

2008

Recent Development of Nano-solder Paste for Electronics Interconnect Applications

Johan Liu, Cristina Andersson, Yulai Gao et al

Proceedings of the IEEE 10th Electronics Packaging Technology Conference

Paper in proceeding

2008

Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Lili Zhang, Wenkai Tao, Johan Liu et al

Proceedings of the 2008 International Conference on Electronics Packaging Technology &　High Density Packaging, p. E1-1 0

Paper in proceeding

2008

Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Cristina Andersson, Johan Liu

International Journal of Fatigue, p. 917-930

Journal article

2007

Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Sun Peng, Cristina Andersson, Johan Liu

Journal of Alloys and Compounds

Journal article

2007

Effect of Corrosion on the Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Cristina Andersson, Johan Liu

International Journal of Fatigue

Journal article

2007

Reliability, fatigue and mechanical characterization of lead-free solders for electronic packaging applications

Cristina Andersson

Doctoral thesis

2007

Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al

Microelectronics and Reliability. Vol. 47 (2-3), p. 266-272

Journal article

2006

Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions

Cristina Andersson

Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany

Paper in proceeding

2006

Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty

Cristina Andersson

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China

Paper in proceeding

2006

Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty

Cristina Andersson, Peng Sun, Johan Liu

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 19-26

Paper in proceeding

2006

Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles

Suresh Chand Verma, Wanbing Guan, Cristina Andersson et al

Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 282-286

Paper in proceeding

2006

Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing

Peng Sun, Cristina Andersson, Johan Liu et al

Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 760-767

Paper in proceeding

2006

High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization

Peng Sun, Cristina Andersson, Xi-cheng Wei et al

Journal of Alloys and Compounds. Vol. 425 (1-2), p. 191-199

Journal article

2006

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Peng Sun, Cristina Andersson, Xicheng Wei et al

Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), p. 1468-1475

Paper in proceeding

2006

Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions

Cristina Andersson, Johan Liu

ESTC 2006 - 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006, p. 457-467

Paper in proceeding

2006

Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy

Cristina Andersson, L. Liu, Johan Liu

Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, p. 152-160

Paper in proceeding

2006

Characterization of Nanoparticles of Lead Free Solder Alloys

Wanbing Guan, Suresh Chand Verma, Yulai Gao et al

Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 7-12

Paper in proceeding

2006

Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint

C. Bailey, Peng Sun, Xicheng Wei et al

Soldering and Surface Mount Technology. Vol. 18 (2), p. 4-11

Journal article

2006

Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Peng Sun, Cristina Andersson, Xicheng Wei et al

Materials Science & Engineering B: Solid-State Materials for Advanced Technology. Vol. 135 (2), p. 134-140

Journal article

2005

Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints

Peng Sun, Cristina Andersson, Xicheng Wei et al

Soldering and surface Mount Technology. Vol. 17 (4), p. pp38-45

Journal article

2005

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints

Cristina Andersson

IMAPS 2005

Other conference contribution

2005

Lead-free soldering assessment using different board finishes

Cristina Andersson

New Exploratory Technologies 2005

Other conference contribution

2005

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings. Vol. 2005, p. 523-528

Paper in proceeding

2005

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al

Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp342-347

Paper in proceeding

2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson

Materials Science and Engineering. Vol. A (394), p. 20-27

Journal article

2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson, Zonghe Lai, Johan Liu

Materials Science and Engineering A. Vol. 394, p. 20-27

Journal article

2005

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al

Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. 696-700

Paper in proceeding

2005

Thermal cycling and reliability of lead free BGA components

Cristina Andersson, Dag Andersson, Johan Liu

IMAPS Europe Brugge, p. pp101-108

Paper in proceeding

2005

Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity

Peng Sun, Cristina Andersson, Zonghe Lai et al

Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp197-202

Paper in proceeding

2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson, Zonghe Lai, Johan Liu et al

Materials Science and Engineering. Vol. A (394), p. pp20-27

Journal article

2004

Thermodynamic assessment of Sn-Co lead-free solder system

Libin Liu, Cristina Andersson, Johan Liu

Journal of Electronic Materials. Vol. 33 (9), p. p 935-

Journal article

2004

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components

Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al

Proceedings of the 5th international conference on thermal, mechanical and thermo-mechanical simulation and experiments in micro-electronics and micro-systems (EuroSimE). Vol. May (10th to 12th), p. pp 455-464

Paper in proceeding

2004

Low cycle fatigue and reliability characterisation of lead free solders

Cristina Andersson

Licentiate thesis

2003

Development of a web-based course on lead-free solders

Johan Liu, Cristina Andersson

ECTC´03, p. 739-742

Paper in proceeding

2003

Thermodynamic Assessment of Sn-Co-Cu Lead-free Solder Alloy

Libin Liu, Cristina Andersson, Johan Liu et al

Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition, p. 2003-35126

Paper in proceeding

2001

Low Cycle fatigue of lead-free solders

Cristina Andersson, Xitao Wang, Zonghe Lai et al

The Fourth International Symposium on Electronic Packaging Technology, p. 462-470

Paper in proceeding

2001

Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders

Cristina Andersson, Xitao Wang, Zonghe Lai et al

Proceedings of the IMAPS Nordic, p. 298-303

Paper in proceeding

2000

Fatigue properties of lead-free solders

Xitao Wang, Cristina Andersson, Zonghe Lai et al

Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, p. 163-169

Paper in proceeding

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