Shuangxi Sun

Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

Anisotropic thermal conductivity of vertically self-ordered Nanocrystalline Boron Nitride thin films for thermal hotspot mitigation in electronics

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Test structures for studying flexible interconnect supported by carbon nanotube scaffolds

Evaluating CNT-Based Interconnects : A Nummerical Tool to Characterize Hybrid CNT-Copper Interconnects

2017

Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Carbon nanotube growth on different underlayers for thermal interface material application

Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Thermal properties of TIM using CNTs forest in electronics packaging

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Application of two-dimensional layered hexagonal boron nitride in chip cooling

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Chemically enhanced carbon nanotubes based Thermal Interface Materials

Cooling hot spots by hexagonal boron nitride heat spreaders

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Characterization of Nanoscale Materials for 3D IC Interconnect and Heat Dissipation Applications

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Carbon nanotube/solder hybrid structure for interconnect applications

Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material