Yifeng Fu

Researcher at Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Dr Yifeng Fu holds a PHD degree from Chalmers University of Technology in microelectronics. Before joining Chalmers, he has worked in SHT Smart High Tech AB as project manager and research manager, where he was in charge of the overall research and development of materials and technologies. His research interest covers carbon nano- and 2D materials for 3D electronics packaging. This includes the synthesis and processing of CNTs, graphene and related 2D materials for thermal management and interconnect applications. He has published more than 50 papers in journals and proceedings.

Source: chalmers.se

Showing 87 publications

2019

Reliability investigation of a carbon nanotube array thermal interface material

Andreas Nylander, Josef Hansson, Majid Kabiri Samani et al
Energies. Vol. 12 (11)
Journal article
2019

A portable micro glucose sensor based on copper-based nanocomposite structure

Huang Chen, Guokang Fan, Jie Zhao et al
New Journal of Chemistry. Vol. 43 (20), p. 7806-7813
Journal article
2019

Compact and low loss electrochemical capacitors using a graphite / carbon nanotube hybrid material for miniaturized systems

Qi Li, S. Sun, Anderson David Smith et al
Journal of Power Sources, p. 374-383
Journal article
2018

Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
Advanced Materials Interfaces. Vol. 2018 (5)
Journal article
2018

Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors

Ya Liu, Xiaoli Zhao, Cancan Wang et al
Journal of Materials Chemistry A. Vol. 6 (37), p. 18267-18275
Journal article
2018

Understanding noninvasive charge transfer doping of graphene: a comparative study

Ankit Nalin Mehta, Wei Mu, Murali Murugesan et al
Journal of Materials Science: Materials in Electronics. Vol. 29 (7), p. 5239-5252
Journal article
2017

Synthesis Methods of Two-Dimensional MoS2: A Brief Review

Jie Sun, X. J. Li, W. L. Guo et al
Crystals. Vol. 7 (7), p. Article no 198 -
Journal article
2017

An overview of carbon nanotubes based interconnects for microelectronic packaging

S. Chen, B. Shan, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 113-119
Paper in proceedings
2017

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Di Jiang, Shuangxi Sun, Michael Edwards et al
Flexible and Printed Electronics. Vol. 2 (2)
Journal article
2017

Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier

S. Huang, W. Ke, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 143-146
Paper in proceedings
2017

Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications

ANDREAS NYLANDER, Yifeng Fu, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 175-181
Paper in proceedings
2017

Graphene-CNT hybrid material as potential thermal solution in electronics applications

C. C. Darmawan, L. Ye, Majid Kabiri Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 190-193
Paper in proceedings
2017

Chemical vapor deposition grown graphene on Cu-Pt alloys

Yong Zhang, Yifeng Fu, Michael Edwards et al
Materials Letters. Vol. 193, p. 255-258
Journal article
2016

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability. Vol. 56, p. 129-135
Journal article
2016

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Yong Zhang, S. Huang, Nan Wang et al
China Semiconductor Technology International Conference (CSTIC) (Shanghai, March 13-14)
Conference contribution
2016

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

Wei Mu, Yifeng Fu, Shuangxi Sun et al
Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114
Journal article
2016

The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging

Shirong Huang, Jie Bao, N. Wang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. Art no 7583272; Pages 889-892
Paper in proceedings
2016

Carbon nanotube growth on different underlayers for thermal interface material application

Yifeng Fu, Shuangxi Sun, Wei Mu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceedings
2016

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Shuangxi Sun, Wei Mu, Michael Edwards et al
Nanotechnology. Vol. 27 (33), p. Art no335705-
Journal article
2016

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Shuangxi Sun, Peng Su, Nan Wang et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper in proceedings
2016

Graphene oxide based coatings on Nitinol for biomedical implant applications: Effectively promote mammalian cell growth but kill bacteria

Changhong Zhao, Santosh Pandit, Yifeng Fu et al
RSC Advances. Vol. 6 (44), p. 38124-38134
Journal article
2016

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Journal article
2016

Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Kjell Jeppson, Jie Bao, S. Huang et al
29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016, p. 32-36
Paper in proceedings
2016

Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique

Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceedings
2016

Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

Yong Zhang, Michael Edwards, Kabir Majid Samani et al
Carbon. Vol. 106, p. 195-201
Journal article
2016

Application of two-dimensional layered hexagonal boron nitride in chip cooling

Jie Bao, Y. Zhang, S. Huang et al
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. Vol. 24 (1), p. 210-217
Magazine article
2016

Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Wei Mu, Eun-Hye Kwak, Bingan Chen et al
Electronic Materials Letters. Vol. 12 (3), p. 329-337
Journal article
2016

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Wei Mu, Josef Hansson, Shuangxi Sun et al
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 31-Jun 03, 2016, p. 211-216
Paper in proceedings
2016

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

Yifeng Fu, Wei Mu, Shuangxi Sun et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764713-
Paper in proceedings
2016

Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging

Shirong Huang, N. Wang, Jie Bao et al
6th Electronic System-integration Technology Conference (ESTC 2016), p. Article no 7764696-
Paper in proceedings
2016

Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

Jie Bao, Michael Edwards, Shirong Huang et al
Journal of Physics D: Applied Physics. Vol. 49 (July 2016), p. 265501-
Journal article
2016

Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing

Jie Bao, Kjell Jeppson, Michael Edwards et al
Electronic Materials Letters. Vol. 12 (1), p. 1-16
Journal article
2016

Graphene-based heater

Yong Zhang, Michael Edwards, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016; Tonsberg; Norway; 5-7 June 2016
Paper in proceedings
2016

Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art

Abdelhafid Zehri, Josef Hansson, Lilei Ye et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper in proceedings
2016

Functionalization mediates heat transport in graphene nanoflakes

H. X. Han, Yong Zhang, Nan Wang et al
Nature Communications. Vol. 7
Journal article
2016

Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Wei Mu, Yifeng Fu, Shuangxi Sun et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceedings
2015

Cooling hot spots by hexagonal boron nitride heat spreaders

Shuangxi Sun, Jie Bao, Wei Mu et al
2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 26-29 May 2015, p. 1658-1663
Paper in proceedings
2015

Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires

Nan Wang, Di Jiang, L. Ye et al
Advanced Functional Materials. Vol. 25 (26), p. 4135-4143
Journal article
2015

Reliability of Graphene-based Films Used for High Power Electronics Packaging

Shirong Huang, Yong Zhang, Nan Wang et al
16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015, p. 852-855
Paper in proceedings
2015

Liquid Phase Exfoliated Graphene for Thermal Management in Electronic Packaging

Yong Zhang, Yifeng Fu, Ye Lilei et al
Graphene Week in Manchester
Paper in proceedings
2015

Chemically enhanced carbon nanotubes based Thermal Interface Materials

J. Daon, Shuangxi Sun, Di Jiang et al
2015 21st International Workshop on Thermal Investigations of Ics and Systems (Therminic)
Conference contribution
2015

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability
Journal article
2015

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Di Jiang, Wei Mu, Si Chen et al
IEEE Electron Device Letters. Vol. 36 (5), p. 499-501
Journal article
2015

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 2015 (17 April), p. http://dx.doi.org/10.1007/s11664-015-3752-2-
Journal article
2014

Reliability of carbon nanotube bumps for chip on glass application

X. Fan, X. Li, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962753-
Paper in proceedings
2014

Use of graphene-based films for hot spot cooling

Yong Zhang, Pengtu Zhang, Nan Wang et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962834-
Paper in proceedings
2014

Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips

Yan Zhang, C. He, Yong Zhang et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014, p. 1507-1511
Paper in proceedings
2014

Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules

Hao xue han, Y. A. Kosevich, Yong Zhang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014, p. 1-4
Paper in proceedings
2014

1. Thermal Characterization of Power Devices Using Graphene-based Film

Johan Liu, Pengtu Zhang, Nan Wang et al
2014 Electronic Components & Technology Conference, p. 459 - 463
Paper in proceedings
2014

Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

J. Daon, Shuangxi Sun, Di Jiang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014
Paper in proceedings
2014

Carbon nanotube/solder hybrid structure for interconnect applications

Di Jiang, Shuangxi Sun, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962751-
Paper in proceedings
2014

CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS

Johan Liu, Yifeng Fu, Di Jiang
Proceedings of the 12th international conference on Solid States and Integrated Circuits, ICSICT2014, p. 47-50
Paper in proceedings
2013

Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration

Johan Liu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (1), p. 13-27
Journal article
2013

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Shirong Huang, Yong Zhang, Shuangxi Sun et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 403-408
Paper in proceedings
2013

Experimental study of Electrical properties and stability of CNT bumps in high density interconnects

Yan Zhang, Yingjie Zhou, Jingyu Fan et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 1085-1088
Paper in proceedings
2013

Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth

Liang Xu, Di Jiang, Yifeng Fu et al
Proceedings of the 19th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems, September 25-27 2013, Berlin, Germany, IEEE / Therminic 2013, p. 248-252
Paper in proceedings
2013

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

Liang Xu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (3), p. 236-240
Journal article
2013

Reliability of Carbon Nanotube Bumps for Chip on Film Application

X. Li, Wei Mu, Di Jiang et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 845-848
Paper in proceedings
2013

Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Shirong Huang, Yong Zhang, Shuangxi Sun et al
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), p. 347-352
Paper in proceedings
2013

Graphene Heat Spreader for Thermal Management of Hot Spots

Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the IEEE 2013 Electronic Components & Technology Conference, p. 2075-2078
Paper in proceedings
2012

Thick film patterning by lift-off process using double-coated single photoresists

Yifeng Fu, L. Ye, Johan Liu
Materials Letters. Vol. 76, p. 117-119
Journal article
2012

Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate

Di Jiang, Yifeng Fu, Yan Zhang et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, Budapest, 25-27 September 2012, p. 213-216
Paper in proceedings
2012

Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon

Zhili Hu, Gustaf Mårtensson, Murali Murugesan et al
Applied Physics Letters. Vol. 101 (13), p. Art. no. 133105-
Journal article
2012

Selective growth of double-walled carbon nanotubes on gold films

Yifeng Fu, Si Chen, Johan Bielecki et al
Materials Letters. Vol. 72, p. 78-80
Journal article
2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Yifeng Fu, Björn Carlberg, Niklas Lindahl et al
Advanced Materials. Vol. 24 (12), p. 1576-1581
Journal article
2012

Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging

Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, p. 217-220
Paper in proceedings
2012

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Yifeng Fu, N. Nabiollahi, Teng Wang et al
Nanotechnology. Vol. 23 (4)
Journal article
2011

Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers

D. Wang, J. He, X. Wang et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 560-563
Paper in proceedings
2010

Use of carbon nanotubes in potential electronics packaging applications

Johan Liu, Teng Wang, Yifeng Fu et al
2010 10th IEEE Conference on Nanotechnology, NANO 2010, p. 160-166
Conference contribution
2010

3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler

N. Nabiollahi, Yifeng Fu, Johan Liu
IMAPS Nordic Annual Conference 2010, Proceedings, p. 44-47
Paper in proceedings
2010

Future Emerging Packaging Technology Using Carbon Nanotubes

Johan Liu, Yiheng Qin, Carl Zandén et al
ELTE 2010 & 34th IMAPS-CPMT
Conference contribution
2010

Application of through silicon via technology for in situ temperature monitoring on thermal interfaces

Yifeng Fu, Teng Wang, Ove Jonsson et al
Journal of Micromechanics and Microengineering. Vol. 20 (2), p. id 025027 (5 pp)-
Journal article
2010

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

Yifeng Fu, Yiheng Qin, Teng Wang et al
Advanced Materials. Vol. 22 (44), p. 5039-5042
Journal article
2009

A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink

Shun Wang, Yan Zhang, Yifeng Fu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 255-259
Paper in proceedings
2009

Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg

Yifeng Fu, Teng Wang, Johan Liu
Proceedings of the Annual Nordic Conference, p. 35-38
Paper in proceedings
2009

Carbon Nanotubes as Cooling Fins in Microelectronic Systems

Yifeng Fu, Teng Wang, Johan Liu et al
Proceedings of the 9th Nanotechnology Conference, p. 10-14
Paper in proceedings
2009

Development of a test platform for thermal characterization using through-silicon-via technology

Yifeng Fu, Teng Wang, Johan Liu
IMAPS Nordic Annual Conference 2009; Tonsberg; Norway; 13 September 2009 through 15 September 2009, p. 35-38
Paper in proceedings
2008

Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

Johan Liu, Yifeng Fu, Teng Wang
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E3-01
Paper in proceedings
2008

A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers

Yi Fan, Yifeng Fu, Yan Zhang et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-05
Paper in proceedings
2008

Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material

Björn Carlberg, Teng Wang, Yifeng Fu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1395-1400
Paper in proceedings
2008

A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers

Yi Fan, Yifeng Fu, Yan Zhang et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
Paper in proceedings
2008

Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant

Yi Fan, Yifeng Fu, Teng Wang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1391-1394
Paper in proceedings
2008

Nanostructured Polymer-metal Composite for Thermal Interface Material Applications

Björn Carlberg, Teng Wang, Yifeng Fu et al
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), p. 191-197
Paper in proceedings
1993

Estimation of Moisture Variations on Paper Machines

Guy Dumont, I. Jonsson, M. Davies et al
IEEE Transacrtions on Control Systems Technology. Vol. 1 (2)
Journal article

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