Johan Liu

Improved Thermal Properties of Three-Dimensional Graphene Network Filled Polymer Composites

2021

Graphene-based films: Fabrication, interfacial modification, and applications

Heat transfer analysis of phase change materials with metal foams

2021

Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates

2021

A Novel Graphene Quantum Dot-Based mRNA Delivery Platform

Characterizatoin of Longitudinal Thermal Conductivity of Graphene Film

2021

Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation

Characterterization of multi-scale nanosilver paste reinforced with SIC particles

2020

Graphene related materials for thermal management

Analysis of heat dissipation characteristics of three-dimensional graphene-carbon nanotube composite structures

2020

Effects of high temperature treatment of carbon nanotube arrays on graphite: increased crystallinity, anchoring and inter-tube bonding

Bipolar electrochemical capacitors using double-sided carbon nanotubes on graphite electrodes

Improved Interfacial Bonding Strength and Reliability of Functionalized Graphene Oxide for Cement Reinforcement Applications

2020

Thermally reduced graphene oxide/carbon nanotube composite films for thermal packaging applications

2020

Synthesis of graphene quantum dots and their applications in drug delivery

2020

High porosity and light weight graphene foam heat sink and phase change material container for thermal management

Enhanced electrochemical performance of three-dimensional graphene/carbon nanotube composite for supercapacitor application

2020

Multiple growth of graphene from a pre-dissolved carbon source

2020

Effect of Nanopowder Addition on the Sintering of Water-Atomized Iron Powder

Graphene based thermal management system for battery cooling in electric vehicles

2020

Properties of Undoped Few-Layer Graphene-Based Transparent Heaters

Thermally Conductive Graphene Film/Indium/Aluminum Laminated Composite by Vacuum Assisted Hot-pressing

Graphene oxide for nonvolatile memory application by using electrophoretic technique

Highly Oriented Graphite Aerogel Fabricated by Confined Liquid-Phase Expansion for Anisotropically Thermally Conductive Epoxy Composites

Scalable production of thick graphene films for next generation thermal management applications

Electrical monitoring of concrete using a novel structural sensor based on conductive cementitious mortar

Highly thermal conductive and light-weight graphene-based heatsink

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

2019

Atomic Layer Deposition of Buffer Layers for the Growth of Vertically Aligned Carbon Nanotube Arrays

Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles

2019

Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor

2019

Preparation of graphene/aligned carbon nanotube array composite films for thermal packaging applications

Thermal conductivity enhancement of carbon@ carbon nanotube arrays and bonded carbon nanotube network

Effect of Boron Nitride Particle Geometry on the Thermal Conductivity of a Boron Nitride Enhanced Polymer Composite Film

Experimental Measurements of Thermal Performances of Carbon Nanomaterial with Vertical Structures in Hotspot Heat Dissipation

Graphene-coated copper nanoparticles for thermal conductivity enhancement in water-based nanofluid

RF properties of carbon nanotube / Copper composite through silicon via based CPW structure for 3D integrated circuits

Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings

Effect of pressure during graphitization on mechanical properties of graphene films

Covalent anchoring of carbon nanotube-based thermal interface materials using epoxy-silane monolayers

Highly Thermal Conductive and Light -weight Craphene-based Heatsink

Chemical Vapor Deposition of Vertically Aligned Carbon Nanotube Arrays: Critical Effects of Oxide Buffer Layers

Thermal interface materials based on vertically aligned carbon nanotube arrays: A review

2019

Reliability investigation of a carbon nanotube array thermal interface material

Highly thermal conductive and electrically insulated graphene based thermal interface material with long-term reliability

Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material

Mechanical properties of a novel multi-scale silver paste for electronics interconnect application

Compact and low loss electrochemical capacitors using a graphite / carbon nanotube hybrid material for miniaturized systems

Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles

Carbon Nanotubes for thermal management of Microsystems

Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials

Novel nanostructured thermal interface materials: a review

Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering

Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation

MDS Investigation on the Melting and Solidification of Silver Nanoparticles

Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors

Conductive adhesive based on mussel-inspired graphene decoration with silver nanoparticles

The influence of sintering process on thermal properties of nano-silver paste

Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications

Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications

Anisotropic thermal conductivity of vertically self-ordered Nanocrystalline Boron Nitride thin films for thermal hotspot mitigation in electronics

Light-weight Compressible and Highly Thermal Conductive Graphene-based Thermal Interface Material

Elevated thermoelectric figure of merit of n-type amorphous silicon by efficient electrical doping process

Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity

2018

Understanding noninvasive charge transfer doping of graphene: a comparative study

Low-Temperature Sintering Bimodal Micro Copper-Nano Silver for Electrical Power Devices

Surface analysis of iron and steel nanopowder

Critical atomic-level processing technologies: Remote plasma-enhanced atomic layer deposition and atomic layer etching

Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-heating CVD for Thermal Applications

An overview of carbon nanotubes based interconnects for microelectronic packaging

Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays

Silver decorated graphene-polyvinyl alcohol hybrid hydrogel as catalyst for benzonitrile conversion

Concrete setting and hardening monitoring using a novel graphene-based sensor

Sintering of SiC enhanced copper paste for high power applications

Fabrication and characterization of a carbon fiber solder composite thermal interface material

Investigation of thermal interface materials reinforced with micro- and nanoparticles

Effect of sintering method on properties of nanosilver paste

2017

Design analysis of adhesively bonded structures

Evaluating CNT-Based Interconnects : A Nummerical Tool to Characterize Hybrid CNT-Copper Interconnects

2017

The large enriched germanium experiment for neutrinoless double beta decay (LEGEND)

Control of Nanoplane Orientation in voBN for High Thermal Anisotropy in a Dielectric Thin Film: A New Solution for Thermal Hotspot Mitigation in Electronics

Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging

Synthesis of tunable hydrogels based on O-acetyl-galactoglucomannans from spruce

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier

Fabrication and characterization of graphene based film

Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications

Synthesis and characterization of three-dimensional graphene foams by chemical vapor deposition

Interface and interconnection stresses in electronic assemblies – A critical review of analytical solutions

Stretchable Thermoelectric Generators Metallized with Liquid Alloy

Graphene-CNT hybrid material as potential thermal solution in electronics applications

Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials

Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures

Graphene-based heat spreading materials for electronics packaging applications

Chemical vapor deposition grown graphene on Cu-Pt alloys

Development of bulk-nanostructuring methods for BiSbTe Thermoelectric

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor

2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS

Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder

The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging

A review of recent progress of thermal interface materials: from research to industrial applications

Carbon nanotube growth on different underlayers for thermal interface material application

Nanophotonics-based low-temperature PECVD epitaxial crystalline silicon solar cells

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

Enhanced cooling properties of radar antenna electronics using novel materials

Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications

Heat dissipation of a hybrid CNT/Graphene based heat spreader

Graphene oxide based coatings on Nitinol for biomedical implant applications: Effectively promote mammalian cell growth but kill bacteria

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Thermal properties of TIM using CNTs forest in electronics packaging

A brief overview of atomic layer deposition and etching in the semiconductor processing

Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation

Experimental investigation of paraffin wax with graphene enhancement as thermal management materials for batteries

Synthesis of highly conductive and mechanically strong silver coated silk bundles for flexible electronic applications

Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique

Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

FREESTANDING CARBON NANOFIBERS/GRAPHENE COMPOSITE ELECTRODES FOR SUPERCAPACITORS

Application of two-dimensional layered hexagonal boron nitride in chip cooling

Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes

Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review

Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging

Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging

Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing

Graphene-based heater

2016

Preventing Aging of Electrically Conductive Adhesives on Metal Substrate Using Graphene-Based Barrier

Finite element simulation of 2D-based materials as heat spreaders

Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art

2016

Functionalization mediates heat transport in graphene nanoflakes

Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor

Flexible Multi-functionalized Carbon Nanotubes Based Hybrid Nanowires

Thermal elastomer composites for soft transducers

2015

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

Cooling hot spots by hexagonal boron nitride heat spreaders

Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires

Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation

Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application

A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material

Reliability of Graphene-based Films Used for High Power Electronics Packaging

Liquid Phase Exfoliated Graphene for Thermal Management in Electronic Packaging

Chemically enhanced carbon nanotubes based Thermal Interface Materials

Combination of positive charges and honeycomb pores to promote MC3T3-E1 cell behaviour

Measurement of Dielectric Properties of Ultrafine BaTiO3 Using an Organic-Inorganic Composite Method

The promising application of graphene oxide coatings in orthopedic implants: preparation, characterization, cell behavior, and antimicrobial activity

Photonic nanostructures for advanced light trapping in thin crystalline silicon solar cells

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

The promising application of graphene oxide as coating materials in orthopedic implants: preparation, characterization and cell behavior

Reliability of carbon nanotube bumps for chip on glass application

Energy efficient nano metal polymer composites for cooling applications

Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application

Use of graphene-based films for hot spot cooling

Carbon fiber solder matrix composite for thermal management of high power electronics

A new solder matrix nano polymer composite for thermal management and die attach applications

Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications

Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips

A carbon fiber solder matrix composite for thermal management of microelectronic devices

2014

Pre-Study of Graphene-Enhanced Cementitious Materials

Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules

Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications

A Novel Method for Three-Dimensional Culture of Central Nervous System Neurons.

Development and characterization of graphene-enhanced thermal conductive adhesives

1. Thermal Characterization of Power Devices Using Graphene-based Film

A new solder matrix nano polymer composite for thermal management applications

Stem cell responses to plasma surface modified electrospun polyurethane scaffolds.

HB-EGF affects astrocyte morphology, proliferation, differentiation and the expression of intermediate filament proteins

Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

A solder joint structure with vertically aligned carbon nanofibres as reinforcements

HB-EGF affects astrocyte morphology, proliferation, differentiation, and the expression of intermediate filament proteins

Carbon nanotube/solder hybrid structure for interconnect applications

Characterization of nano-enhanced interconnect materials for fine pitch assembly

CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS

Experimental results versus numerical simulations of In/Cu intermetallic compounds growth

Investigation on interaction between indium based thermal interface material and copper and silicon substrates

Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration

Characterization for Graphene as Heat Spreader Using Thermal Imaging Method

Mechanical properties of a novel Nano-Thermal Interface Material

Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo-like morphological complexity of astroglial cells

Experimental study of Electrical properties and stability of CNT bumps in high density interconnects

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

Surface oxide analysis of lead-free solder particles

Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth

2013

Molecular dynamics simulation of inertial trapping-induced atomic scale mass transport inside single walled carbon nanotubes

Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications

Experimental Study on the Mechanical Reliability of Carbon Nanotubes

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots

Reliability of Carbon Nanotube Bumps for Chip on Film Application

Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology

Graphene Heat Spreader for Thermal Management of Hot Spots

Experimental measurements for mechanical and electrical conductive properties of CNT bundles

Low Partial Pressure Chemical Vapor Deposition of Graphene on Copper

Thick film patterning by lift-off process using double-coated single photoresists

Environmental reliability of nano-structured polymer-metal composite thermal interface material

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

Development and Characterization of Nano-Composite Solder

Characterization of CNT Enhanced Conductive Adhesives in Terms of Thermal Conductivity

Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler

Organic Thin-Film Transistors with Anodized Gate Dielectric Patterned by Self-Aligned Embossing on Flexible Substrates

Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate

Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

Polymer-metal nanofibrous composite for thermal management of microsystems

Electrical Interconnects Made of Carbon Nanotubes: Applications in 3D Chip Stacking

Effect of microstructural evolution in electrically conductive adhesives containing Ag micro-fillers

Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology

2012

Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide

Thermal performance characterization of nano thermal interface materials after power cycling

2012

Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon

Selective growth of double-walled carbon nanotubes on gold films

2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging

TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder

Reliability investigation of nano-enhanced thermal conductive adhesives

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Direct Chemical Vapor Deposition of Large-Area Carbon Thin Films on Gallium Nitride for Transparent Electrodes: A First Attempt

2012

A method to integrate patterned electrospun fibers with microfluidic systems to generate complex microenvironments for cell culture applications

Surface characterisation of oxygen plasma treated electrospun polyurethane fibres and their interaction with red blood cells

Patterned electrospun microfibers integrated in a microfluidic system to study cells in complex microenvironments

A New Thermally Conductive Thermoplastic Die Attach Film

Cell road - biomaterials for neural stem cell migration

Reliability of Microtechnology – Interconnects, Devices and Systems

Study on the reliability of fast curing isotropic conductive adhesive

Investigation of accelerated surface oxidation of Sn-3,5Ag-0,5Cu solder particles by TEM and STEM

Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives

Electrical and thermal conductivities of thermally conductive adhesives composed of a multi-functional epoxy resin containing Ag-plated Cu fillers

Numerical investigation on thermal properties of micro-pin-fin cooler

Numerical study of the interface heat transfer characteristics of micro-cooler with CNT structures

Characterization of surface oxide of lead-free solder particle by TEM and STEM

Influence of substrate on electrical conductivity of isotropic conductive adhesive

Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

Study into high temperature reliability of isotropic conductive adhesive

Comparisons of nano-additives influence on properties of the bi-modal solder pastes for special applications

Molecular dynamics simulation for the bonding energy of metal-SWNT interface

The effect of functionalized silver on properties of conductive adhesives

Benchmarking assembly materials for vertically aligned carbon nanotubes into microsystems

Molecular Gun Composed of Carbon Nanotube

Surface-Confined Synthesis of Silver Nanoparticle Composite Coating on Electrospun Polyimide Nanofibers

Study on the bimodal filler influence on the effective thermal conductivity of thermal conductive adhesive

Electrospun polyurethane-based elastomer fibers for biomedical applications

Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers

Study on the reliability of nano-structured polymer-metal composite for thermal interface material

Numerical study of thermal transfer between adhesive and CNTs

Printed monopole antenna with extremely wide bandwidth on liquid crystal polymer substrates

The effect of functionalized silver on rheological and electrical properties of conductive adhesives

A highly conductive bimodal isotropic conductive adhesive and its reliability

Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

Development and characterisation of nanofiber films with high adhesion

Surface properties of electrospun polyurethane-based elastomer networks for biomedical applications

Nanofiber based composites for thermal management

Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill

Use of carbon nanotubes in potential electronics packaging applications

Aging effects on electrical and thermal conductivities of electrically conductive adhesvies of composed of a heat resistant epoxy binder

3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler

Dry densification of carbon nanotube bundles

Future Emerging Packaging Technology Using Carbon Nanotubes

The effect of modulus on the performance of thermal conductive adhesives

MDS Investigation on the Heat Transfer Properties of CNT Micro-Channel Cooler

A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

Reliability of isotropic conductive adhesive joints

Effects of BN and SiC nanoparticles on properties of conductive adhesive

Polymer nanofiber based continuous metal phase composite for thermal management applications

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

Anisotropic Thermal Conductivity in Electrically Conductive Adhesives with Single- and Bimodal Filler-size Distributions Containing Ag Flakes and Micro-particles

New fast curing isotropic conductive adhesive for electronic packaging application

Design of Printed Monopole Antennas on Liquid Crystal Polymer Substrates

Thermal Conductivity in the Vertical Direction of Heat-Resistant Epoxy Based Conductive Adhesives with Multimodal Filler Size Distributions

Reliability characterisation of bi-modal high temperature stable Isotropic Conductive Adhesives

Direct Photolithographic Patterning of Electrospun Films for Defined Nanofibrillar Microarchitectures

Optimization of stiffness for isotropic conductive adhesives

Application of through silicon via technology for in situ temperature monitoring on thermal interfaces

MDS study on the adhesive heat transfer in micro-channel cooler

A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Numerical investigation on the thermal properties of the micro-cooler

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

Interpenetrating phase polymer-metal composite for thermal interface material applications

Reliability study for high temperature stable conductive adhesives

Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive

Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications

Polymer-metal nano-composite films for thermal management

Evaluation of new and improved thermal interface materials and surface roughness effect on thermal interface resistance

Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg

3D chip stacking using planarized carbon nanotubes as through-silicon-vias

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Termiskt ledande metall/polymer nanokompositfilm samt tillhörande tillverkningsmetoder

Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model

Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.

Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Carbon Nanotubes as Cooling Fins in Microelectronic Systems

Coffin-Mansson equation of Sn-4.0Ag-0.5Cu solder joint

The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder

Through silicon vias filled with planarized carbon nanotube bundles

Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

Thermal management technologies for electronics based on multiwalled carbon nanotube bundles: As power consumption increases, so does the need for more efficient heat removal technologies

Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy

Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging

Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging

Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate

Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA

Development of a test platform for thermal characterization using through-silicon-via technology

FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

A Compact Ultra-Wideband Bandpass Filter with Ultra-Fine Conductor Trace based on Liquid Crystal Polymer Substrates

Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip

Thermal Conductivity of Electrically Conductive Adhesives Containing Fillers with Multi-modal Particle Size Distributions

Development of High Temperature Stable Isotropic Conductive Adhesives

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates

The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths

RF Performance of Flip Chip ACA Joints for CPW Transmission Lines

A METHOD STUDY OF CFD SIMULATION FOR CNT MICROCOOLER

Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging

A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers

Effect of Encapsulation on OLED Characteristics with Anisotropic Conductive Adhesive

Recent Progress of Thermal Interface Material Research – An Overview

Thermal cycling aging effect on the shear strength, microstructure, IMC and initiation and propagation of surface mounted Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components

Heat transfer simulation of nanofluids in microfluidic channels

Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material

Overview of Carbon Nanotubes as Off-Chip Interconnects

Vibration and Bucling of a carbon nanotbue inserted with a carbon chain

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Electrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder

Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection

Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection

Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints

Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects

A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers

Vibration and buckling of a carbon nanotube inserted with a carbon chain

Recent Advances in the Synthesis of Lead-free Solder Nanoparticle

Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant

Recent Progress of Thermal Interface Materials

Nanostructured Polymer-metal Composite for Thermal Interface Material Applications

Development of Nanomaterials and Devices for Electronics Cooling and Interconnect

Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material

Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application

The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish

Millimeter-wave ultra-wideband bandpass filter based on LCP substrates for automotive radar systems

Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications

Preparation of polysulfoneamide electrospinning nanofibers

Användning av ett kompositmaterial som termiskt kontaktmaterial för mikroelektroniska komponenter

Recent Development of Nano-solder Paste for Electronics Interconnect Applications

Understanding BGA interconnect interface behaviour using Micropolar theory

Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

Electrically Conductive Adhesives

Encapsulation of OLED device by Using Anisotropic Conductive Adhesive

Electrospun Nano-fibrous Polymer Films with Barium Titanate Nanoparticles for Embedded Capacitor Applications

Reliability characterisation of lead free solder joints using three point bending test

PBGA Interconnect Behavior under Thermal Effects

Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection

An aging study of intermetallic compounds formation in Sn-0.4Co-0.7Cu

Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material

Process and pad design optimization for 01005 passive component surface mount assembly

Second order multi-scale micropolar model for microsystem interconnections

Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive

Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints

Interface modelling microsystem interconnections using micropolar theory and discontinuous approximation

A Study of Effects of Different Coolants on On-chip Cooling with Carbon Nanotube Micro-fin Architectures by Using Computational Fluid Dynamics Simulation

Advances in Europe - China Green Electronics Collaboration

Tensile fracture behaviour of Sn-3.0Ag-0.5Cu solder joints on copper

Manufacturing and Characterisation of Silver nano particles based Nano Thermal Interface material

Effect of Corrosion on the Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints

Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders

Realization of A Ultra Wideband BPF based on LCP Substrate for Wireless Application

Reliability aspects of electronics packaging technology using anisotropic conductive adhesives

A method for determining elastic properties of micron-sized polymer particles by using flat punch test

Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Investigation of the Effect of Processing Variables on the Structure and Morphology of Nano-TIM

Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging

Design for Embedded Chinese Display Smart Card

Characterization of Nanoparticles of Lead Free Solder Alloys

Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Development and Characterization of Microcoolers using Carbon Nanotubes

Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Assessment of Lead-Free Inert Gas Soldering Using a Novel Reflow Technology

Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly

Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint

Consequential toxicity assessment of the global shift to Pb free solder paste

Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection

New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications

RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints

Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions

Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty

Integrated inductors on liquid crystal polymer substrate for RF applications

Interface Modelling of ACA Interconnects Using Micropolar Theory

Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy

Development of nanosolders and nanothermal interface materials and cooling devices based on nanocarbon tubes

Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection

Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC

New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging

Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization

Development of SOP Module Technology Based on LCP Substrate for High Frequency Electronics Applications

On the heat transfer enhancement based on micro-scale air impingingment jets with microstructure heat sink in electronics cooling

Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles

Reliability of Conductive adhesives

Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints

Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications

Integrated Capacitors and Resistors on Liquid Crystal Polymer Substrate

Reliability analysis of embedded chip technique with design of experiment methods

Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation

Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate

Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic Conductive Adhesive Joining Technology

Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling

Characterization of thermally conductive epoxy nano-composites

Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation

Conductive adhesives

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive

Reliability of conductive adhesives in electronics packaging

Thermal cycling and reliability of lead free BGA components

An Ontology of ICA for Microsystem applications

Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity

Development of an ontology for the ACA technology in electronics applications

Adhesion study of copper layer deposited and liquid crystalline polymer for electronics packaging

Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Reliability of Conductive adhesives

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Application of Simplified Methods for Partial Environmental Assessment of Microelectronics Soldering Materials and Processes in Small and Medium Sized Enterprises

Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints

THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE

Design for Manufacturability and Reliability of Embedded Display Smart Card

Characterisation of Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Integrated Nanotube Microcooler for Microelectronics Applications

Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model

Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints

Characterization of Metal- coated Polymer Spheres and its Use in Anisotropic Conductive Adhesive

LCA of Electronic Products - An environmental assessment of Gallium Arsenide Monolithic Microwave Integrated Circuit System in Package (SIP) switch product

High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive

Electron conduction through nano particles in electrically conductive adhesives

Thermodynamic assessment of Sn-Co lead-free solder system

2004

Uncertainty estimation by Monte Carlo Simulation applied to Life Cycle Inventory of Cordless Phones and Microscale Metallization Processes

Characterization of electrical and mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive

Reliability Modeling and Simulation of Anisotropic Conductive Adhesive Flip-Chip Bonding Assembly using Global/Local FEM Approach

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology

The deformation Characterization of Conductive Particles in Anisotropically Conductive Adhesive Using FEM

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Process Development and Reliability for System-in-a-Package Using Liquid Crystal Polymer Substrate

Conductive adhesives

Thermal Fatigue Cracking of Surface Mount Conductive Adhesive Joints

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology

Conductive adhesives

Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance

Environmental Assessment of Embedded chip manufacturing Technology

Characterization of Substrate Materials for System-in-a-Package Applications

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components

Integrating nano carbon tubes with microchannel cooler

Integrated Inductors on Liquid Crystal Polymer Substrate for RF Applications

Study on thermomechanical reliability of a tunable light modulator

Uncertainty estimation by Monte-Carlo Simulation applied to life cycle inventory of cordless phones and microscale metallization processes

Electron conduction through nano particles in electrically conductive adhesives

Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications

Thermodynamic Assessment of Sn-Co-Cu Lead-free Solder Alloy

Electrical conduction characteristics of anisotropic conductive adhesive particles, Guangbin Dou

Development of a web-based course on lead-free solders

Electron conduction through nano particles in electrically conductive adhesives

System-on-Packaging: A Broad Perspective from System Design to Technology Development

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate using the peel test with different moisture environment