Johan Liu
Professor vid
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
Dr Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden. Before joining Chalmers University of Technology, he served in various positions at the Swedish Institute for Production Engineering Research (IVF) as project manager, group leader and division manager. He is currently full professor in electronics production and head of Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience in Chalmers University of Technology, Sweden. As a member of the Royal Swedish Academy of Engineering Sciences and a fellow of IEEE, he has published 500 papers in journals, conference proceedings and book chapters with a Hirsch index of 29 in Web of Science (WoS) and 39 in Google Scholar Citation System (Google Scholar) and with a citation of over 2840 times (WoS) or 6000 (Google Scholar). He has 75 patents accepted or filed and has given 55 keynote/invited talks. In addition to this, he has published 35 papers with impact factor over 3,5 (8 of them over 10) including those in Nature Communications, Advanced Materials, Advanced Functional Materials, Nanoenergy, Small, Carbon, Journal of Materials Chemistry, Biomicrofludics, Tissue Engineering, Glia, Langmuir, Scientific Reports, IEEE Electron Deveic Letters and IEEE CPMT Transactions, Applied Physics Letters, Nanotechnology, IEEE Nanotechnology, Journal of Composite Science and Technology and European Polymer Journal. He has also received many awards including IEEE Exceptional Technical Achievement Award, IEEE CPMT Transaction Best paper award in “Advanced Packaging”. His research field covers mainly nanoelectronics, microsystems packaging and 3D additive manufacturing materials and processes including vertical stacking CNT TSV technology, CNT/graphene assisted cooling technology, graphene heat spreader, high temperature stable conductive adhesives, nano-soldering, nano-thermal interface materials and biomedical nanoscaffolds. He has successfully run over 70 research projects funded by National Science Fundation, Swedish Board for Strategic Research (SSF), Natoinal Swedish Board for Innovation (Vinnova) and Formas, Sweden as well as EU FP6, FP7 and Horizon 2020 programs.
Källa: chalmers.se
Visar 482 publikationer
2019
Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles
Xu Long, Zhen Li, Xiuzhen Lu et al
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. Vol. 744, p. 406-414
Artikel i vetenskaplig tidskrift
2019
Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor
Shujing Chen, Abdelhafid Zehri, Qianlong Wang et al
ChemistryOpen. Vol. 8 (1), p. 58-63
Artikel i vetenskaplig tidskrift
2019
Compact and low loss electrochemical capacitors using a graphite / carbon nanotube hybrid material for miniaturized systems
Qi Li, S. Sun, Anderson David Smith et al
Journal of Power Sources, p. 374-383
Artikel i vetenskaplig tidskrift
2018
Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds
Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
Advanced Materials Interfaces. Vol. 2018 (5)
Artikel i vetenskaplig tidskrift
2018
Novel nanostructured thermal interface materials: a review
Josef Hansson, Torbjörn M. J. Nilsson, L. Ye et al
International Materials Reviews. Vol. 63 (1), p. 22-45
Artikel i vetenskaplig tidskrift
2018
Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering
Nan Wang, Majid Kabiri Samani, Hu Li et al
Small. Vol. 14 (29)
Artikel i vetenskaplig tidskrift
2018
Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation
Xu Long, Chongyang Du, Zhen Li et al
International Journal of Applied Mechanics. Vol. 10 (10)
Artikel i vetenskaplig tidskrift
2018
MDS Investigation on the Melting and Solidification of Silver Nanoparticles
Yan Zhang, Guoqiang Zhang, Xiuzhen Lu et al
2018 19th International Conference on Electronic Packaging Technology (ICEPT) , p. 5-9
Paper i proceeding
2018
Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors
Ya Liu, Xiaoli Zhao, Cancan Wang et al
Journal of Materials Chemistry A. Vol. 6 (37), p. 18267-18275
Artikel i vetenskaplig tidskrift
2018
Conductive adhesive based on mussel-inspired graphene decoration with silver nanoparticles
Marcello Casa, Maria Sarno, Rosalba Liguori et al
Journal of Nanoscience and Nanotechnology. Vol. 18 (2), p. 1176-1185
Artikel i vetenskaplig tidskrift
2018
The influence of sintering process on thermal properties of nano-silver paste
Xiuzhen Lu, Qianran Zhang, Abdelhafid Zehri et al
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), p. 1157-1160
Paper i proceeding
2018
Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications
Nan Wang, Shujing Chen, Amos Nkansah et al
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), p. 1588-1592
Paper i proceeding
2018
Anisotropic thermal conductivity of vertically self-ordered Nanocrystalline Boron Nitride thin films for thermal hotspot mitigation in electronics
S. H. Tsang, O. Cometto, Majid Kabiri Samani et al
2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 - Proceedings, p. 25-27
Paper i proceeding
2018
Light-weight Compressible and Highly Thermal Conductive Graphene-based Thermal Interface Material
Nan Wang, S. Chen, Amos Nkansah et al
2018 7th Electronic System-Integration Technology Conference (ESTC)
Paper i proceeding
2018
Elevated thermoelectric figure of merit of n-type amorphous silicon by efficient electrical doping process
Debashree Banerjee, Örjan Vallin, Majid Kabiri Samani et al
Nano Energy. Vol. 44, p. 89-94
Artikel i vetenskaplig tidskrift
2018
Understanding noninvasive charge transfer doping of graphene: a comparative study
Ankit Nalin Mehta, Wei Mu, Murali Murugesan et al
Journal of Materials Science: Materials in Electronics. Vol. 29 (7), p. 5239-5252
Artikel i vetenskaplig tidskrift
2018
Low-Temperature Sintering Bimodal Micro Copper-Nano Silver for Electrical Power Devices
Abdelhafid Zehri, L. Ye, Johan Liu
2018 7th Electronic System-Integration Technology Conference (ESTC)
Paper i proceeding
2018
Surface analysis of iron and steel nanopowder
Swathi Kiranmayee Manchili, Ruslan Shvab, Abdelhafid Zehri et al
Surface and Interface Analysis (Special Issue), p. 1-6
Artikel i vetenskaplig tidskrift
2017
An overview of carbon nanotubes based interconnects for microelectronic packaging
S. Chen, B. Shan, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 113-119
Paper i proceeding
2017
Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays
Lin Jing, Kabir Majid Samani, B. Liu et al
ACS Applied Materials & Interfaces. Vol. 9 (17), p. 14555-14560
Artikel i vetenskaplig tidskrift
2017
Silver decorated graphene-polyvinyl alcohol hybrid hydrogel as catalyst for benzonitrile conversion
Marcello Casa, Maria Sarno, Johan Liu et al
Advanced Science Letters. Vol. 23 (6), p. 5980-5983
Artikel i vetenskaplig tidskrift
2017
Sintering of SiC enhanced copper paste for high power applications
Martí Gutierrez, Nan Wang, Majid Kabiri Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 151-156
Paper i proceeding
2017
Fabrication and characterization of a carbon fiber solder composite thermal interface material
Josef Hansson, L. Ye, Johan Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 97-100
Paper i proceeding
2017
Investigation of thermal interface materials reinforced with micro- and nanoparticles
K. Janeczek, A. Arazna, Y. Zhang et al
China Semiconductor Technology International Conference 2017, CSTIC 2017
Paper i proceeding
2017
Effect of sintering method on properties of nanosilver paste
Q. Zhang, Johan Liu, W. Ke et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 186-189
Paper i proceeding
2017
Design analysis of adhesively bonded structures
Ee Hua Wong, Johan Liu
Polymers. Vol. 9 (12)
Artikel i vetenskaplig tidskrift
2017
Evaluating CNT-Based Interconnects : A Nummerical Tool to Characterize Hybrid CNT-Copper Interconnects
Silvia Bistarelli, Shuangxi Sun, Luca Pierantoni et al
IEEE Microwave Magazine. Vol. 18 (4), p. 124-129
Artikel i vetenskaplig tidskrift
2017
The large enriched germanium experiment for neutrinoless double beta decay (LEGEND)
N. Abgrall, A. Abramov, N. Abrosimov et al
AIP Conference Proceedings. Vol. 1894
Paper i proceeding
2017
Control of Nanoplane Orientation in voBN for High Thermal Anisotropy in a Dielectric Thin Film: A New Solution for Thermal Hotspot Mitigation in Electronics
O. Cometto, Majid Kabiri Samani, B. Liu et al
ACS Applied Materials & Interfaces. Vol. 9 (8), p. 7456-7464
Artikel i vetenskaplig tidskrift
2017
Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging
Y. Yang, H. Ye, W. Ke et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 125-128
Paper i proceeding
2017
Synthesis of tunable hydrogels based on O-acetyl-galactoglucomannans from spruce
Kajsa Markstedt, W. Xu, Johan Liu et al
Carbohydrate Polymers. Vol. 157, p. 1349-1357
Artikel i vetenskaplig tidskrift
2017
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
Di Jiang, Shuangxi Sun, Michael Edwards et al
Flexible and Printed Electronics. Vol. 2 (2)
Artikel i vetenskaplig tidskrift
2017
Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier
S. Huang, W. Ke, Y. Yang et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 143-146
Paper i proceeding
2017
Fabrication and characterization of graphene based film
Yuqing Shi, L. Ye, Abdelhafid Zehri et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 162-166
Paper i proceeding
2017
Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications
ANDREAS NYLANDER, Yifeng Fu, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 175-181
Paper i proceeding
2017
Synthesis and characterization of three-dimensional graphene foams by chemical vapor deposition
Yong Zhang, Kabir Majid Samani, Johan Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 139-142
Paper i proceeding
2017
Interface and interconnection stresses in electronic assemblies – A critical review of analytical solutions
E. H. Wong, Johan Liu
Microelectronics and Reliability. Vol. 79, p. 206-220
Artikel i vetenskaplig tidskrift
2017
Stretchable Thermoelectric Generators Metallized with Liquid Alloy
Seung Hee Jeong, Francisco Javier Cruz, Si Chen et al
ACS Applied Materials & Interfaces. Vol. 9 (18), p. 15791-15797
Artikel i vetenskaplig tidskrift
2017
Graphene-CNT hybrid material as potential thermal solution in electronics applications
C. C. Darmawan, L. Ye, Majid Kabiri Samani et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 190-193
Paper i proceeding
2017
Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials
Maulik Satwara, Josef Hansson, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 167-171
Paper i proceeding
2017
Efficient surface modification of carbon nanotubes for fabricating high performance CNT based hybrid nanostructures
Nan Wang, Santosh Pandit, L. Ye et al
Carbon. Vol. 111, p. 402-410
Artikel i vetenskaplig tidskrift
2017
Graphene-based heat spreading materials for electronics packaging applications
G. Yuan, B. Shan, S. Chen et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 172-174
Paper i proceeding
2017
Chemical vapor deposition grown graphene on Cu-Pt alloys
Yong Zhang, Yifeng Fu, Michael Edwards et al
Materials Letters. Vol. 193, p. 255-258
Artikel i vetenskaplig tidskrift
2016
Development of bulk-nanostructuring methods for BiSbTe Thermoelectric
ANDREAS NYLANDER, Nikolaos Logothetis, Johan Liu
IMAPS Nordic Annual Conference 2016 Proceedings
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2016
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability. Vol. 56, p. 129-135
Artikel i vetenskaplig tidskrift
2016
Controllable and fast synthesis of bilayer graphene by chemical vapor deposition on copper foil using a cold wall reactor
Wei Mu, Yifeng Fu, Shuangxi Sun et al
Chemical Engineering Journal. Vol. 304 (15 November 2016), p. 106-114
Artikel i vetenskaplig tidskrift
2016
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS
Yong Zhang, S. Huang, Nan Wang et al
China Semiconductor Technology International Conference (CSTIC) (Shanghai, March 13-14)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2016
Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder
Lilei Ye, Si Chen, Johan Liu
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016
The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging
Shirong Huang, Jie Bao, N. Wang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. Art no 7583272; Pages 889-892
Paper i proceeding
2016
A review of recent progress of thermal interface materials: from research to industrial applications
Josef Hansson, Liley Ye, Henric Rhedin et al
IMAPS Nordic Annual Conference 2016 Proceedings; Tonsberg; Norway; 5 - 7 June 2016
Paper i proceeding
2016
Carbon nanotube growth on different underlayers for thermal interface material application
Yifeng Fu, Shuangxi Sun, Wei Mu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016
Nanophotonics-based low-temperature PECVD epitaxial crystalline silicon solar cells
W. H. Chen, R. Cariou, M. Foldyna et al
Journal of Physics D: Applied Physics. Vol. 49 (12)
Artikel i vetenskaplig tidskrift
2016
Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects
Shuangxi Sun, Wei Mu, Michael Edwards et al
Nanotechnology. Vol. 27 (33), p. Art no335705-
Artikel i vetenskaplig tidskrift
2016
Enhanced cooling properties of radar antenna electronics using novel materials
Torbjörn Nilsson, Lilei Ye, Johan Liu
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016
Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications
Josef Hansson, Carl Zandén, L. Ye et al
2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano), p. 371-374
Paper i proceeding
2016
Heat dissipation of a hybrid CNT/Graphene based heat spreader
Shuangxi Sun, Peng Su, Nan Wang et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper i proceeding
2016
Graphene oxide based coatings on Nitinol for biomedical implant applications: Effectively promote mammalian cell growth but kill bacteria
Changhong Zhao, Santosh Pandit, Yifeng Fu et al
RSC Advances. Vol. 6 (44), p. 38124-38134
Artikel i vetenskaplig tidskrift
2016
Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors
Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Artikel i vetenskaplig tidskrift
2016
Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders
Kjell Jeppson, Jie Bao, S. Huang et al
29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016, p. 32-36
Paper i proceeding
2016
A brief overview of atomic layer deposition and etching in the semiconductor processing
G. Yuan, N. Wang, Shirong Huang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. 1365-1368
Paper i proceeding
2016
Thermal properties of TIM using CNTs forest in electronics packaging
Dongsheng Zhang, Johan Liu, Shuangxi Sun et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016; Wuhan Optics Valley Kingdom Hotel Wuhan; China; 16 August 2016 through 19 August 2016, p. 1355-1359
Paper i proceeding
2016
Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation
Xin Luo, J. C. Peng, Carl Zandén et al
Acta Materialia. Vol. 104, p. 109-118
Artikel i vetenskaplig tidskrift
2016
Experimental investigation of paraffin wax with graphene enhancement as thermal management materials for batteries
Yan Zhang, Wang Yue, Shaochun Zhang et al
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p. 1401-1405
Paper i proceeding
2016
Synthesis of highly conductive and mechanically strong silver coated silk bundles for flexible electronic applications
Nan Wang, Hafid Zehri, Lilei Ye et al
IMAPS Nordic Annual Conference 2016 Proceedings
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2016
Thermal conductivity measurement of densified carbon nanotube bundles by pulsed photothermal reflectance technique
Majid Kabiri Samani, Shuangxi Sun, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016
Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications
Yong Zhang, Michael Edwards, Kabir Majid Samani et al
Carbon. Vol. 106, p. 195-201
Artikel i vetenskaplig tidskrift
2016
Efficient Surface Modification of Carbon Nanotubes for Fabricating High Performance CNT Based Hybrid Nanostructures
Nan Wang, Santosh Pandit, Lilei Ye et al
Carbon
Artikel i vetenskaplig tidskrift
2016
FREESTANDING CARBON NANOFIBERS/GRAPHENE COMPOSITE ELECTRODES FOR SUPERCAPACITORS
Volodymyr Kuzmenko, Nan Wang, Arun Bhaskar et al
The World Conference on Carbon - Carbon 2016, July 10-15, State College, PA, USA
Paper i proceeding
2016
Application of two-dimensional layered hexagonal boron nitride in chip cooling
Jie Bao, Y. Zhang, S. Huang et al
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. Vol. 24 (1), p. 210-217
Artikel i övriga tidskrifter
2016
Enhanced Cold Wall CVD Reactor Growth of Horizontally Aligned Single-walled Carbon Nanotubes
Wei Mu, Eun-Hye Kwak, Bingan Chen et al
Electronic Materials Letters. Vol. 12 (3), p. 329-337
Artikel i vetenskaplig tidskrift
2016
Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives
Nan Wang, Nikolaos Logothetis, Wei Mu et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764682-
Paper i proceeding
2016
Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
Yifeng Fu, Wei Mu, Shuangxi Sun et al
2016 6th Electronic System-Integration Technology Conference (Estc), p. Article no 7764713-
Paper i proceeding
2016
Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects
Wei Mu, Josef Hansson, Shuangxi Sun et al
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 31-Jun 03, 2016, p. 211-216
Paper i proceeding
2016
Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging
Shirong Huang, N. Wang, Jie Bao et al
6th Electronic System-integration Technology Conference (ESTC 2016), p. Article no 7764696-
Paper i proceeding
2016
Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging
Jie Bao, Michael Edwards, Shirong Huang et al
Journal of Physics D: Applied Physics. Vol. 49 (July 2016), p. 265501-
Artikel i vetenskaplig tidskrift
2016
Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing
Jie Bao, Kjell Jeppson, Michael Edwards et al
Electronic Materials Letters. Vol. 12 (1), p. 1-16
Artikel i vetenskaplig tidskrift
2016
Graphene-based heater
Yong Zhang, Michael Edwards, Yifeng Fu et al
IMAPS Nordic Annual Conference 2016; Tonsberg; Norway; 5-7 June 2016
Paper i proceeding
2016
Preventing Aging of Electrically Conductive Adhesives on Metal Substrate Using Graphene-Based Barrier
Hui Ye, Shirong Huang, Kjell Jeppson et al
2016 China Semiconductor Technology International Conference (CSTIC), p. Shanghai, China-
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2016
Finite element simulation of 2D-based materials as heat spreaders
Michael Edwards, Yong Zhang, Jie Bao et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2016
Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art
Abdelhafid Zehri, Josef Hansson, Lilei Ye et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper i proceeding
2016
Functionalization mediates heat transport in graphene nanoflakes
H. X. Han, Yong Zhang, Nan Wang et al
Nature Communications. Vol. 7
Artikel i vetenskaplig tidskrift
2016
Large area and uniform monolayer graphene CVD growth on oxidized copper in a cold wall reactor
Wei Mu, Yifeng Fu, Shuangxi Sun et al
IMAPS Nordic Annual Conference 2016 Proceedings
Paper i proceeding
2015
Flexible Multi-functionalized Carbon Nanotubes Based Hybrid Nanowires
Nan Wang, Di Jiang, Lilei Ye et al
Advanced Functional Materials
Artikel i vetenskaplig tidskrift
2015
Thermal elastomer composites for soft transducers
Seung Hee Jeong, Si Chen, Jinxing Huo et al
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015, p. 1873-1876
Paper i proceeding
2015
Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment
Seung Hee Jeong, Si Chen, Jinxing Huo et al
Scientific Reports. Vol. 5, p. 18257-
Artikel i vetenskaplig tidskrift
2015
Cooling hot spots by hexagonal boron nitride heat spreaders
Shuangxi Sun, Jie Bao, Wei Mu et al
2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 26-29 May 2015, p. 1658-1663
Paper i proceeding
2015
Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires
Nan Wang, Di Jiang, L. Ye et al
Advanced Functional Materials. Vol. 25 (26), p. 4135-4143
Artikel i vetenskaplig tidskrift
2015
Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation
Xin Luo, Jianchao Peng, Carl Zandén et al
Acta Materialia
Artikel i vetenskaplig tidskrift
2015
Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application
Yong Zhang, H. X. Han, Nan Wang et al
Advanced Functional Materials. Vol. 25 (28), p. 4430-4435
Artikel i vetenskaplig tidskrift
2015
A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material
Si Chen, Nikolaos Logothetis, L. Ye et al
Materials Today: Proceedings. Vol. 2 (2), p. 610-619
Paper i proceeding
2015
Reliability of Graphene-based Films Used for High Power Electronics Packaging
Shirong Huang, Yong Zhang, Nan Wang et al
16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015, p. 852-855
Paper i proceeding
2015
Liquid Phase Exfoliated Graphene for Thermal Management in Electronic Packaging
Yong Zhang, Yifeng Fu, Ye Lilei et al
Graphene Week in Manchester
Paper i proceeding
2015
Chemically enhanced carbon nanotubes based Thermal Interface Materials
J. Daon, Shuangxi Sun, Di Jiang et al
2015 21st International Workshop on Thermal Investigations of Ics and Systems (Therminic)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2015
Combination of positive charges and honeycomb pores to promote MC3T3-E1 cell behaviour
C. H. Zhao, C. J. Pan, Joakim Sandstedt et al
RSC Advances. Vol. 5 (53), p. 42276-42286
Artikel i vetenskaplig tidskrift
2015
Measurement of Dielectric Properties of Ultrafine BaTiO3 Using an Organic-Inorganic Composite Method
Jie Bao, W. W. Wang, S. T. Li et al
Journal of Electronic Materials. Vol. 44 (7), p. 2300-2307
Artikel i vetenskaplig tidskrift
2015
The promising application of graphene oxide coatings in orthopedic implants: preparation, characterization, cell behavior, and antimicrobial activity
Johan Liu, Changhong Zhao, Xiuzhen Lu et al
Journal of Biomedical Materials Research - Part A
Artikel i vetenskaplig tidskrift
2015
Photonic nanostructures for advanced light trapping in thin crystalline silicon solar cells
C. Trompoukis, I. Abdo, R. Cariou et al
Physica Status Solidi (A) Applications and Materials. Vol. 212 (1), p. 140-155
Artikel i vetenskaplig tidskrift
2015
Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging
Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability
Artikel i vetenskaplig tidskrift
2015
Vertically stacked carbon nanotube-based interconnects for through silicon via application
Di Jiang, Wei Mu, Si Chen et al
IEEE Electron Device Letters. Vol. 36 (5), p. 499-501
Artikel i vetenskaplig tidskrift
2015
Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications
Wei Mu, Shuangxi Sun, Di Jiang et al
Journal of Electronic Materials. Vol. 2015 (17 April), p. http://dx.doi.org/10.1007/s11664-015-3752-2-
Artikel i vetenskaplig tidskrift
2015
Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles
Si Chen, Xin Luo, Di Jiang et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 5 (8), p. 1186-1196
Artikel i vetenskaplig tidskrift
2015
The promising application of graphene oxide as coating materials in orthopedic implants: preparation, characterization and cell behavior
C. H. Zhao, X. Lu, Carl Zandén et al
Biomedical Materials (Bristol). Vol. 10 (1), p. Art.no. 015019-
Artikel i vetenskaplig tidskrift
2014
Reliability of carbon nanotube bumps for chip on glass application
X. Fan, X. Li, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962753-
Paper i proceeding
2014
Energy efficient nano metal polymer composites for cooling applications
Johan Liu, Carl Zandén, Lilei Ye
Chinese Conference on Functional Materials, Sept 25-27, 2014,
Paper i proceeding
2014
Ultra-short vertically aligned carbon nanofibers transfer and application as bonding material
Johan Liu
Soldering and Surface Mount Technology
Artikel i vetenskaplig tidskrift
2014
Characterization of Nano-Enhanced Interconnect Materials for Fine Pitch Assembly
Johan Liu
Soldering and Surface Mount Technology
Artikel i vetenskaplig tidskrift
2014
Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application
J. Sitek, M. Koscielski, Y. Zhang et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014 (Art. no. 6922625), p. 151-154
Paper i proceeding
2014
Use of graphene-based films for hot spot cooling
Yong Zhang, Pengtu Zhang, Nan Wang et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962834-
Paper i proceeding
2014
Carbon fiber solder matrix composite for thermal management of high power electronics
Murali Murugesan, Carl Zandén, Xin Luo et al
Journal of Materials Chemistry. Vol. 2 (35), p. 7184-7187
Artikel i vetenskaplig tidskrift
2014
A new solder matrix nano polymer composite for thermal management and die attach applications
Johan Liu, Carl Zandén, Xin Luo et al
Composites Science and Technology. Vol. 94, p. 54-61
Artikel i vetenskaplig tidskrift
2014
Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications
Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Artikel i vetenskaplig tidskrift
2014
Study on the verification of IR and RTD methods applied in the thermal measurement of high power chips
Yan Zhang, C. He, Yong Zhang et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014, p. 1507-1511
Paper i proceeding
2014
A carbon fiber solder matrix composite for thermal management of microelectronic devices
Murali Murugesan, Carl Zandén, Xin Luo et al
Journal of Materials Chemistry C. Vol. 2 (35), p. 7184-7187
Artikel i vetenskaplig tidskrift
2014
Pre-Study of Graphene-Enhanced Cementitious Materials
Luping Tang, Johan Liu, Nan Wang et al
Rapport
2014
Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules
Hao xue han, Y. A. Kosevich, Yong Zhang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014, p. 1-4
Paper i proceeding
2014
Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications
Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Artikel i vetenskaplig tidskrift
2014
A Novel Method for Three-Dimensional Culture of Central Nervous System Neurons.
Till B. Puschmann, Yolanda de Pablo, Carl Zandén et al
Tissue engineering. Part C, Methods. Vol. 20 (6), p. 485-492
Artikel i vetenskaplig tidskrift
2014
Development and characterization of graphene-enhanced thermal conductive adhesives
Marcello Casa, S. Huang, Paolo Ciambelli et al
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014 (Art. no. 6922700), p. 480-483
Paper i proceeding
2014
1. Thermal Characterization of Power Devices Using Graphene-based Film
Johan Liu, Pengtu Zhang, Nan Wang et al
2014 Electronic Components & Technology Conference, p. 459 - 463
Paper i proceeding
2014
A new solder matrix nano polymer composite for thermal management applications
Carl Zandén, Xin Luo, L. Ye et al
Composites Science and Technology. Vol. 94, p. 54-61
Artikel i vetenskaplig tidskrift
2014
Stem cell responses to plasma surface modified electrospun polyurethane scaffolds.
Carl Zandén, Nina Hellström Erkenstam, Thomas Padel et al
Nanomedicine: Nanotechnology, Biology, and Medicine. Vol. 10 (5), p. 949-958
Artikel i vetenskaplig tidskrift
2014
HB-EGF affects astrocyte morphology, proliferation, differentiation and the expression of intermediate filament proteins
Johan Liu
Journal of Neurochemistry
Artikel i vetenskaplig tidskrift
2014
Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats
J. Daon, Shuangxi Sun, Di Jiang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014
Paper i proceeding
2014
A solder joint structure with vertically aligned carbon nanofibres as reinforcements
S. Chen, Di Jiang, L. Ye et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962851-
Paper i proceeding
2014
HB-EGF affects astrocyte morphology, proliferation, differentiation, and the expression of intermediate filament proteins
Till B. Puschmann, Carl Zandén, Isabell Lebkuechner et al
Journal of Neurochemistry. Vol. 128 (6), p. 878-889
Artikel i vetenskaplig tidskrift
2014
Carbon nanotube/solder hybrid structure for interconnect applications
Di Jiang, Shuangxi Sun, Wei Mu et al
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, p. Art. no. 6962751-
Paper i proceeding
2014
Characterization of nano-enhanced interconnect materials for fine pitch assembly
Y. Zhang, J. Sitek, J. Fan et al
Soldering and Surface Mount Technology. Vol. 26 (1), p. 12-17
Artikel i vetenskaplig tidskrift
2014
CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS
Johan Liu, Yifeng Fu, Di Jiang
Proceedings of the 12th international conference on Solid States and Integrated Circuits, ICSICT2014, p. 47-50
Paper i proceeding
2014
Experimental results versus numerical simulations of In/Cu intermetallic compounds growth
T. Fałat, B.T. Płatek, P.K. Matkowski et al
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Marina Bay Sands, Singapore, 3-5 December 2014, p. 797-800
Paper i proceeding
2013
Investigation on interaction between indium based thermal interface material and copper and silicon substrates
Fatat Tomasz, Ptatek Barotsz, Matkowski Przemystaw et al
19th European Microelectronics and Packaging Conference, EMPC 2013; Grenoble; France; 9 September 2013 through 12 September 2013
Paper i proceeding
2013
Carbon Nanotubes for Electronics Manufacturing and Packaging: From Growth to Integration
Johan Liu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (1), p. 13-27
Artikel i vetenskaplig tidskrift
2013
Characterization for Graphene as Heat Spreader Using Thermal Imaging Method
Shirong Huang, Yong Zhang, Shuangxi Sun et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 403-408
Paper i proceeding
2013
Mechanical properties of a novel Nano-Thermal Interface Material
Wangli Peng, Carl Zandén, Lilei Ye et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 942-945
Paper i proceeding
2013
Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo-like morphological complexity of astroglial cells
Till B. Puschmann, Carl Zandén, Yolanda de Pablo et al
GLIA. Vol. 61 (3), p. 432-440
Artikel i vetenskaplig tidskrift
2013
Experimental study of Electrical properties and stability of CNT bumps in high density interconnects
Yan Zhang, Yingjie Zhou, Jingyu Fan et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 1085-1088
Paper i proceeding
2013
Surface oxide analysis of lead-free solder particles
Xin Luo, W. Du, X. Lu et al
Soldering and Surface Mount Technology. Vol. 25 (1), p. 39-44
Artikel i vetenskaplig tidskrift
2013
Controlling the Density of CNTs by Different UnderlayerMaterials in PECVD Growth
Liang Xu, Di Jiang, Yifeng Fu et al
Proceedings of the 19th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems, September 25-27 2013, Berlin, Germany, IEEE / Therminic 2013, p. 248-252
Paper i proceeding
2013
Molecular dynamics simulation of inertial trapping-induced atomic scale mass transport inside single walled carbon nanotubes
Z. L. Hu, Gustaf Mårtensson, Murali Murugesan et al
Applied Physics Letters. Vol. 102 (8)
Artikel i vetenskaplig tidskrift
2013
Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications
Carl Zandén, Xin Luo, Lilei Ye et al
19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013; Berlin; Germany; 25 September 2013 through 27 September 2013, p. 286-292
Paper i proceeding
2013
Experimental Study on the Mechanical Reliability of Carbon Nanotubes
Yan Zhang, Ling Wang, Jingyu Fan et al
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT), p. 105-108
Paper i proceeding
2013
Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD
Liang Xu, Di Jiang, Yifeng Fu et al
Advances in Manufacturing. Vol. 1 (3), p. 236-240
Artikel i vetenskaplig tidskrift
2013
Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots
Zhaoli Gao, Yong Zhang, Y. F. Fu et al
Carbon. Vol. 61, p. 342-348
Artikel i vetenskaplig tidskrift
2013
Reliability of Carbon Nanotube Bumps for Chip on Film Application
X. Li, Wei Mu, Di Jiang et al
Proceedings of the 13th IEEE International Conference on Nanotechnology, p. 845-848
Paper i proceeding
2013
Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
Shirong Huang, Yong Zhang, Shuangxi Sun et al
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), p. 347-352
Paper i proceeding
2013
Graphene Heat Spreader for Thermal Management of Hot Spots
Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the IEEE 2013 Electronic Components & Technology Conference, p. 2075-2078
Paper i proceeding
2013
Experimental measurements for mechanical and electrical conductive properties of CNT bundles
Y. Zhang, Yingjie Zhou, Jing-yu Fan et al
6th International Conference on Nonlinear Mechanics, ICNM 2013; Shanghai; China; 12 August 2013 through 15 August 2013, p. 454-457
Paper i proceeding
2012
Low Partial Pressure Chemical Vapor Deposition of Graphene on Copper
Jie Sun, Niclas Lindvall, Matthew Cole et al
IEEE Transactions on Nanotechnology. Vol. 11 (2), p. 255-260
Artikel i vetenskaplig tidskrift
2012
Thick film patterning by lift-off process using double-coated single photoresists
Yifeng Fu, L. Ye, Johan Liu
Materials Letters. Vol. 76, p. 117-119
Artikel i vetenskaplig tidskrift
2012
Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material
Shuangxi Sun, Wei Mu, Yan Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging (Article number 6474593), p. 171-176
Paper i proceeding
2012
Environmental reliability of nano-structured polymer-metal composite thermal interface material
Xiuzhen Lu, Mengke Zhuang, Lei Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 1326-1328
Paper i proceeding
2012
Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests
Kjell Jeppson, Teng Wang, Di Jiang et al
IEEE Electron Device Letters. Vol. 33 (3), p. 420-422
Artikel i vetenskaplig tidskrift
2012
Development and Characterization of Nano-Composite Solder
Johan Liu, Si Chen, Lilei Ye
Lead-Free Solders: Materials Reliability for Electronics, p. 161-177
Kapitel i bok
2012
Characterization of CNT Enhanced Conductive Adhesives in Terms of Thermal Conductivity
Zhfei Zhang, Lilei Ye, Akos Kukovecz et al
ECS Transactions. Vol. 44 (1), p. 1011-1017
Paper i proceeding
2012
Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler
Yan Zhang, Huifeng Lv, Jing-yu Fan et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 1573-1577
Paper i proceeding
2012
Organic Thin-Film Transistors with Anodized Gate Dielectric Patterned by Self-Aligned Embossing on Flexible Substrates
Yiheng Qin, D. H. Turkenburg, I. Barbu et al
Advanced Functional Materials. Vol. 22 (6), p. 1209-1214
Artikel i vetenskaplig tidskrift
2012
Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate
Di Jiang, Yifeng Fu, Yan Zhang et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, Budapest, 25-27 September 2012, p. 213-216
Paper i proceeding
2012
Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing
Masahiro Inoue, Hiroaki Muta, Shinsuke Yamanaka et al
CD Proceedings of the 4th Electronics System Integration Technologies Conference (ESTC 2012), p. 27-
Paper i proceeding
2012
Formation of three-dimensional carbon nanotube structures by controllable vapor densification
Teng Wang, Di Jiang, Si Chen et al
Materials Letters. Vol. 78, p. 184-187
Artikel i vetenskaplig tidskrift
2012
Polymer-metal nanofibrous composite for thermal management of microsystems
Björn Carlberg, L. Ye, Johan Liu
Materials Letters. Vol. 75, p. 229-232
Artikel i vetenskaplig tidskrift
2012
Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application
Di Jiang, Teng Wang, Si Chen et al
Microelectronic Engineering. Vol. 103, p. Pages 177-180
Artikel i vetenskaplig tidskrift
2012
Electrical Interconnects Made of Carbon Nanotubes: Applications in 3D Chip Stacking
Di Jiang, Lilei Ye, Kjell Jeppson et al
IMAPS Nordic Annual Conference Proceedings 2012, Helsingor, 2 - 4 September 2012, p. 150-159
Paper i proceeding
2012
Effect of microstructural evolution in electrically conductive adhesives containing Ag micro-fillers
Masahiro Inoue, Hiroaki Muta, Johan Liu
Proceedings of the ICEP-IAAC Conference, p. 676-680
Paper i proceeding
2012
Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology
Di Jiang, Teng Wang, Lilei Ye et al
ECS Transactions. Vol. 44 (1), p. 683-692
Paper i proceeding
2012
Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide
Jie Sun, Niclas Lindvall, M. T. Cole et al
Journal of Applied Physics. Vol. 111 (4)
Artikel i vetenskaplig tidskrift
2012
Thermal performance characterization of nano thermal interface materials after power cycling
S. Sun, L. Xin, Carl Zandén et al
Proceedings - Electronic Components and Technology Conference, p. 1426-1430
Paper i proceeding
2012
Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon
Zhili Hu, Gustaf Mårtensson, Murali Murugesan et al
Applied Physics Letters. Vol. 101 (13), p. Art. no. 133105-
Artikel i vetenskaplig tidskrift
2012
Selective growth of double-walled carbon nanotubes on gold films
Yifeng Fu, Si Chen, Johan Bielecki et al
Materials Letters. Vol. 72, p. 78-80
Artikel i vetenskaplig tidskrift
2012
Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene
Yifeng Fu, Björn Carlberg, Niklas Lindahl et al
Advanced Materials. Vol. 24 (12), p. 1576-1581
Artikel i vetenskaplig tidskrift
2012
Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging
Zhaoli Gao, Yong Zhang, Yifeng Fu et al
Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, p. 217-220
Paper i proceeding
2012
TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder
Manman Rui, Xiuzhen Lu, Si Chen et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 203-207
Paper i proceeding
2012
A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity
Yifeng Fu, N. Nabiollahi, Teng Wang et al
Nanotechnology. Vol. 23 (4)
Artikel i vetenskaplig tidskrift
2012
Reliability investigation of nano-enhanced thermal conductive adhesives
Nan Wang, Murali Murugesan, L. Ye et al
Proceedings of the IEEE Conference on Nanotechnology
Paper i proceeding
2012
Direct Chemical Vapor Deposition of Large-Area Carbon Thin Films on Gallium Nitride for Transparent Electrodes: A First Attempt
Jie Sun, M. T. Cole, S. Awais Ahmad et al
IEEE Transactions on Semiconductor Manufacturing. Vol. 25 (3), p. 494-501
Artikel i vetenskaplig tidskrift
2012
A method to integrate patterned electrospun fibers with microfluidic systems to generate complex microenvironments for cell culture applications
Patric Wallin, Carl Zandén, Björn Carlberg et al
Biomicrofluidics. Vol. 6 (2)
Artikel i vetenskaplig tidskrift
2012
Surface characterisation of oxygen plasma treated electrospun polyurethane fibres and their interaction with red blood cells
Carl Zandén, Marina Voinova, Julie Gold et al
European Polymer Journal. Vol. 48 (3), p. 472-482
Artikel i vetenskaplig tidskrift
2012
Patterned electrospun microfibers integrated in a microfluidic system to study cells in complex microenvironments
Patric Wallin, Carl Zandén, Björn Carlberg et al
eCM Journal. Vol. 23 (Supplement 5), p. 65-
Poster (konferens)
2012
A New Thermally Conductive Thermoplastic Die Attach Film
Y. Duan, Lilei Ye, H. Cui et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 212-215
Paper i proceeding
2011
Cell road - biomaterials for neural stem cell migration
Nina Hellström Erkenstam, Carl Zandén, R. Mottaleb et al
European Cells and Materials. Vol. 21 (SUPPL.1), p. 6-
Paper i proceeding
2011
Reliability of Microtechnology – Interconnects, Devices and Systems
Johan Liu, Olli Salmela, Jussi Särkkä et al
Bok
2011
Study on the reliability of fast curing isotropic conductive adhesive
Wenhui Du, Huiwang Cui, Si Chen et al
ECS Transactions. Vol. 34 (1), p. 805 - 810
Paper i proceeding
2011
Investigation of accelerated surface oxidation of Sn-3,5Ag-0,5Cu solder particles by TEM and STEM
Xin Luo, Wenhui Du, Xiuzhen Lu et al
Proceedings of the IEEE 2011 International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011, p. 73 - 79
Paper i proceeding
2011
Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives
D. Li, H. Cui, Q. Fan et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 430-435
Paper i proceeding
2011
Electrical and thermal conductivities of thermally conductive adhesives composed of a multi-functional epoxy resin containing Ag-plated Cu fillers
M. Inoue, H. Muta, S. Yamanaka et al
Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15, p. 941 - 946
Paper i proceeding
2011
Numerical investigation on thermal properties of micro-pin-fin cooler
Yan Zhang, Yangmin Liu, Jing-yu Fan et al
Journal of Shanghai University. Vol. 15 (4), p. 273 - 278
Artikel i vetenskaplig tidskrift
2011
Numerical study of the interface heat transfer characteristics of micro-cooler with CNT structures
Yan Zhang, Shun Wang, Shiwei Ma et al
CD proceedings of IMAPS Poland 2011
Paper i proceeding
2011
Characterization of surface oxide of lead-free solder particle by TEM and STEM
Xin Luo, Wenhui Du, Xiuzhen Lu et al
ICEP, Japan, Nara 2011 April 13-15
Paper i proceeding
2011
Influence of substrate on electrical conductivity of isotropic conductive adhesive
Zhili Hu, Wenhui Du, Cong Yue et al
Proceedings of the IEEE International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011, p. 330 - 335
Paper i proceeding
2011
Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures
L. Zhang, X. Lu, Xin Luo et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 426-429
Paper i proceeding
2011
Study into high temperature reliability of isotropic conductive adhesive
W. Du, H. Cui, S. Chen et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 1053-1055
Paper i proceeding
2011
Comparisons of nano-additives influence on properties of the bi-modal solder pastes for special applications
J. Sitek, Y. Zhang, S. Ma et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 183-187
Paper i proceeding
2011
Molecular dynamics simulation for the bonding energy of metal-SWNT interface
Y. Zhang, Zhili Hu, L. Ye et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 506-509
Paper i proceeding
2011
The effect of functionalized silver on properties of conductive adhesives
Q. Fan, H. Cui, D. Li et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 423-425
Paper i proceeding
2011
Benchmarking assembly materials for vertically aligned carbon nanotubes into microsystems
Teng Wang, Nabi Nabiollahi, Kjell Jeppson et al
CD Proceedings of the Annual World Conference on Carbon, ECUST, Shanghai, China, July 25-29, 2011, Paper no: 740
Paper i proceeding
2011
Molecular Gun Composed of Carbon Nanotube
Zhili Hu, X. Guo, Johan Liu
Journal of Computational and Theoretical Nanoscience. Vol. 8 (9), p. 1716-1719
Artikel i vetenskaplig tidskrift
2011
Surface-Confined Synthesis of Silver Nanoparticle Composite Coating on Electrospun Polyimide Nanofibers
Björn Carlberg, L. Ye, Johan Liu
Small. Vol. 7 (21), p. 3057-3066
Artikel i vetenskaplig tidskrift
2011
Study on the bimodal filler influence on the effective thermal conductivity of thermal conductive adhesive
Y. Zhang, Jing-yu Fan, C. Yue et al
Microsystem Technologies. Vol. 17 (1), p. 93-99
Artikel i vetenskaplig tidskrift
2011
Electrospun polyurethane-based elastomer fibers for biomedical applications
Carl Zandén, Marina Voinova, C. T. Wang et al
European Cells and Materials. Vol. 21 (SUPPL.1), p. 36-
Paper i proceeding
2011
Experimental investigation of gas flow in copper channel carbon nanotubes coated micro coolers
D. Wang, J. He, X. Wang et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 560-563
Paper i proceeding
2011
Study on the reliability of nano-structured polymer-metal composite for thermal interface material
Lei Zhang, Xin Luo, Xiuzhen Lu et al
ECS Transactions. Vol. 34 (1), p. 991- 995
Paper i proceeding
2011
Development and characterisation of nanofiber films with high adhesion
Xin Tang, Hui Wang Cui, Xiu Zhen Lu et al
Proceedings of the IEEE Electronics Components and Technology Conference (ECTC) 2011, May 31 – June 2011, Florida, US, p. 673 - 677
Paper i proceeding
2011
Numerical study of thermal transfer between adhesive and CNTs
Yan Zhang, Shun Wang, Zhili Hu et al
Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15, p. 133 - 137
Paper i proceeding
2011
Printed monopole antenna with extremely wide bandwidth on liquid crystal polymer substrates
X. Zhang, X. Yan, Johan Liu et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 1157-1159
Paper i proceeding
2011
The effect of functionalized silver on rheological and electrical properties of conductive adhesives
Q. Fan, H. Cui, C. Fu et al
ECS Transactions. Vol. 34 (1), p. 811-816
Paper i proceeding
2011
A highly conductive bimodal isotropic conductive adhesive and its reliability
Dongsheng Li, Huiwang Cui, Si Chen et al
ECS Transactions. Vol. 34 (1), p. 583 - 588
Paper i proceeding
2011
Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration
Teng Wang, Kjell Jeppson, L. Ye et al
Small. Vol. 7 (16), p. 2313-2317
Artikel i vetenskaplig tidskrift
2011
Surface properties of electrospun polyurethane-based elastomer networks for biomedical applications
Carl Zandén, Marina Voinova, Chi-Ting Wang et al
Poster at the Second International Conference on Multifunctional, Hybrid and Nanomaterials, Strasbourg, 6-10 March, 2011
Poster (konferens)
2010
Nanofiber based composites for thermal management
Johan Liu, Björn Carlberg
International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill
Xingrui Chen, Teng Wang, Joachim Nurnus et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582779), p. 1250-1254
Paper i proceeding
2010
Use of carbon nanotubes in potential electronics packaging applications
Johan Liu, Teng Wang, Yifeng Fu et al
2010 10th IEEE Conference on Nanotechnology, NANO 2010, p. 160-166
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
Aging effects on electrical and thermal conductivities of electrically conductive adhesvies of composed of a heat resistant epoxy binder
Masahiro Inoue, H Muta, Johan Liu
ICEP Proceedings
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler
N. Nabiollahi, Yifeng Fu, Johan Liu
IMAPS Nordic Annual Conference 2010, Proceedings, p. 44-47
Paper i proceeding
2010
Dry densification of carbon nanotube bundles
Teng Wang, Kjell Jeppson, Johan Liu
Carbon. Vol. 48 (13), p. 3795-3801
Artikel i vetenskaplig tidskrift
2010
Future Emerging Packaging Technology Using Carbon Nanotubes
Johan Liu, Yiheng Qin, Carl Zandén et al
ELTE 2010 & 34th IMAPS-CPMT
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
The effect of modulus on the performance of thermal conductive adhesives
Zhili Hu, Cong Yue, X. Guo et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582884), p. 648-651
Paper i proceeding
2010
MDS Investigation on the Heat Transfer Properties of CNT Micro-Channel Cooler
Yan Zhang, Shun Wang, Jingyu Fan et al
IEEE CPMT Electronics System Integration Conference (ESTC)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder
S. Chen, L. L. Zhang, Johan Liu et al
Materials Transactions. Vol. 51 (10), p. 1720-1726
Artikel i vetenskaplig tidskrift
2010
Reliability of isotropic conductive adhesive joints
Lilei Ye, Johan Liu
Electronics Environment
Artikel i övriga tidskrifter
2010
Effects of BN and SiC nanoparticles on properties of conductive adhesive
Huaxiang Lai, Xiuzhen Lu, H. Cui et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582434), p. 235-239
Paper i proceeding
2010
Polymer nanofiber based continuous metal phase composite for thermal management applications
Björn Carlberg, Johan Liu, L. Ye
3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010, p. Art. no. 5642950-
Paper i proceeding
2010
Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach
C. Yue, Y. Zhang, Z. L. Hu et al
Microsystem Technologies. Vol. 16 (4), p. 633-639
Artikel i vetenskaplig tidskrift
2010
Anisotropic Thermal Conductivity in Electrically Conductive Adhesives with Single- and Bimodal Filler-size Distributions Containing Ag Flakes and Micro-particles
Masahiro Inoue, Hiroaki Muta, Shinsuke Yamanaka et al
3rd Electronics System Integration Technology Conference, ESTC 2010; Berlin; Germany; 13 September 2010 through 16 September 2010
Paper i proceeding
2010
New fast curing isotropic conductive adhesive for electronic packaging application
Wenhui Du, C. Fu, Si Chen et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582446), p. 199-201
Paper i proceeding
2010
Design of Printed Monopole Antennas on Liquid Crystal Polymer Substrates
Xia Zhang, X. Yan, Johan Liu et al
Journal of Infrared, Millimeter, and Terahertz Waves. Vol. 31 (4), p. 469-480
Artikel i vetenskaplig tidskrift
2010
Thermal Conductivity in the Vertical Direction of Heat-Resistant Epoxy Based Conductive Adhesives with Multimodal Filler Size Distributions
Masahiro Inoue, H Muta, S Yamanaka et al
IEEE CPMT Electronics System Integration Conference (ESTC)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
Reliability characterisation of bi-modal high temperature stable Isotropic Conductive Adhesives
W. Tao, S. Chen, X. Liu et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xian, 16-19 August 2010 (Article number 5582437), p. 225-228
Paper i proceeding
2010
Direct Photolithographic Patterning of Electrospun Films for Defined Nanofibrillar Microarchitectures
Björn Carlberg, Teng Wang, Johan Liu
Langmuir. Vol. 26 (4), p. 2235-2239
Artikel i vetenskaplig tidskrift
2010
Optimization of stiffness for isotropic conductive adhesives
C. Fu, Si Chen, Pär Berggren et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 29-33
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
Application of through silicon via technology for in situ temperature monitoring on thermal interfaces
Yifeng Fu, Teng Wang, Ove Jonsson et al
Journal of Micromechanics and Microengineering. Vol. 20 (2), p. id 025027 (5 pp)-
Artikel i vetenskaplig tidskrift
2010
MDS study on the adhesive heat transfer in micro-channel cooler
Shun Wang, Y. Zhang, Zhili Hu et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5583859), p. 630-633
Paper i proceeding
2010
A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles
H. Lai, X. Lu, Si Chen et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 49-53
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film
Xia Zhang, Teng Wang, Pär Berggren et al
ECS Transactions. Vol. 27 (1), p. 825-830
Paper i proceeding
2010
Numerical investigation on the thermal properties of the micro-cooler
Yangming Liu, Y. Zhang, S. Wang et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5583917), p. 634-638
Paper i proceeding
2010
Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly
Yifeng Fu, Yiheng Qin, Teng Wang et al
Advanced Materials. Vol. 22 (44), p. 5039-5042
Artikel i vetenskaplig tidskrift
2010
Interpenetrating phase polymer-metal composite for thermal interface material applications
Björn Carlberg, Johan Liu
IEEE CPMT Electronics System Integration Conference (ESTC)
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2010
Reliability study for high temperature stable conductive adhesives
W. Tao, Si Chen, Pär Berggren et al
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10, p. 74-77
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2009
Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive
Yan Zhang, Cong Yue, Johan Liu et al
ICEP
Paper i proceeding
2009
Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications
Zhili Hu, Björn Carlberg, Cong Yue et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 481-484
Paper i proceeding
2009
Polymer-metal nano-composite films for thermal management
Björn Carlberg, Teng Wang, Johan Liu et al
Microelectronics International. Vol. 26 (2), p. 28-36
Artikel i vetenskaplig tidskrift
2009
Evaluation of new and improved thermal interface materials and surface roughness effect on thermal interface resistance
Carl Zandén, Björn Carlberg, Johan Liu
Proceedings of the The International 3rd Swedish Production Symposium (SPS), p. 88-96
Paper i proceeding
2009
Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg
Yifeng Fu, Teng Wang, Johan Liu
Proceedings of the Annual Nordic Conference, p. 35-38
Paper i proceeding
2009
3D chip stacking using planarized carbon nanotubes as through-silicon-vias
Kjell Jeppson, Teng Wang, Johan Liu et al
Swedish System on Chip Conference
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2009
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Xiangdong Zou, Yulai Gao, Qijie Zhai et al
Journal of Electronic Materials. Vol. 38 (2), p. 351-355
Artikel i vetenskaplig tidskrift
2009
Termiskt ledande metall/polymer nanokompositfilm samt tillhörande tillverkningsmetoder
Johan Liu
Patent
2009
Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model
Yan Zhang, Jinyu Fan, Johan Liu
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 160-163
Paper i proceeding
2009
Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells.
Björn Carlberg, Mathilda Zetterström Axell, Ulf Nannmark et al
Biomedical Materials (Bristol). Vol. 4 (4), p. 45004-
Artikel i vetenskaplig tidskrift
2009
Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles
C.-D. Zou, Y.-L. Gao, B. Yang et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 9-13
Artikel i vetenskaplig tidskrift
2009
Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures
Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies. Vol. 15 (3), p. 375-381
Artikel i vetenskaplig tidskrift
2009
Carbon Nanotubes as Cooling Fins in Microelectronic Systems
Yifeng Fu, Teng Wang, Johan Liu et al
Proceedings of the 9th Nanotechnology Conference, p. 10-14
Paper i proceeding
2009
Coffin-Mansson equation of Sn-4.0Ag-0.5Cu solder joint
S. Chen, Peng Sun, Xi-cheng Wei et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 48-54
Artikel i vetenskaplig tidskrift
2009
The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder
Si Chen, Zhaonian Cheng, Johan Liu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1240-1245
Paper i proceeding
2009
Through silicon vias filled with planarized carbon nanotube bundles
Teng Wang, Kjell Jeppson, Niklas Olofsson et al
Nanotechnology. Vol. 20 (48), p. 485203-
Artikel i vetenskaplig tidskrift
2009
Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages
Cristina Andersson, B. Vandevelde, C. Noritake et al
Soldering and Surface Mount Technology. Vol. 21 (2), p. 28-38
Artikel i vetenskaplig tidskrift
2009
Thermal management technologies for electronics based on multiwalled carbon nanotube bundles: As power consumption increases, so does the need for more efficient heat removal technologies
Johan Liu, Teng Wang, Eleanor E B Campbell
IEEE Nanotechnology Magazine. Vol. 3 (1), p. 17-19
Artikel i vetenskaplig tidskrift
2009
Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
Yulai Gao, Changdong Zou, Bin Yang et al
Journal of Alloys and Compounds. Vol. 484 (1-2), p. 777-781
Artikel i vetenskaplig tidskrift
2009
Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging
Li Xu, Xiuzhen Lu, Johan Liu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1051-1053
Paper i proceeding
2009
Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging
Xiuzhen Lu, Li Xu, Huaxiang Lai et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 1051-1053
Paper i proceeding
2009
Design of 50-70 GHz Planar Wideband Bandpass Filter on Liquid Crystal Polymer Substrate
Xia Zhang, Dan Kuylenstierna, Johan Liu et al
Journal of Infrared, Millimeter, and Terahertz Waves. Vol. 30 (2), p. 183-189
Artikel i vetenskaplig tidskrift
2009
Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA
Cong Yue, Yan Zhang, Zhili Hu et al
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), p. 851-855
Paper i proceeding
2009
Development of a test platform for thermal characterization using through-silicon-via technology
Yifeng Fu, Teng Wang, Johan Liu
IMAPS Nordic Annual Conference 2009; Tonsberg; Norway; 13 September 2009 through 15 September 2009, p. 35-38
Paper i proceeding
2009
FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives
Nabi Nabiollahi, Johan Liu, Zhili Hu et al
2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009, p. 422-425
Paper i proceeding
2009
A Compact Ultra-Wideband Bandpass Filter with Ultra-Fine Conductor Trace based on Liquid Crystal Polymer Substrates
Xia Zhang, Johan Liu, Camilla kärnfeldt et al
Circuit World. Vol. 35 (1), p. 16-21
Artikel i vetenskaplig tidskrift
2009
Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip
Johan Liu, Hans-Georg Kuhn, Jing Yujia et al
Proceedings of the 2009 Electronic Components and Technology Conference, p. 1080-1085
Paper i proceeding
2009
Thermal Conductivity of Electrically Conductive Adhesives Containing Fillers with Multi-modal Particle Size Distributions
Masahiro Inoue, Johan Liu
ICEP, p. 643-648
Paper i proceeding
2008
Development of High Temperature Stable Isotropic Conductive Adhesives
Zhikun Zhang, Sijia Jiang, Johan Liu et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E3-04
Paper i proceeding
2008
Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures
Yi Fan, Xiaolong Zhong, Johan Liu et al
Microsystem Technologies
Artikel i vetenskaplig tidskrift
2008
Carbon Nanotubes for thermal management of Microsystems
Johan Liu, Teng Wang
Nanopackaging, p. 377-394
Kapitel i bok
2008
A Compact V-band Planar Wideband Bandpass Filter Based on Liquid Crystal Polymer Substrates
Xia Zhang, Dan Kuylenstierna, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 163-167
Paper i proceeding
2008
The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths
Guo-Kui Ju, Xi-cheng Wei, Peng Sun et al
Soldering & Surface Mount Technology. Vol. 20 (3), p. 4-10
Artikel i vetenskaplig tidskrift
2008
RF Performance of Flip Chip ACA Joints for CPW Transmission Lines
Xu Wang, Xia Zhang, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 501-506
Paper i proceeding
2008
A METHOD STUDY OF CFD SIMULATION FOR CNT MICROCOOLER
Xiao-long Zhong, Yan Zhang, Johan Liu et al
Proceedings of the Ecology Electronics Conference in “Progress in Eco-Electronics”
Kapitel i bok
2008
Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles
Lili Zhang, Wenkai Tao, Johan Liu et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E1-1 0
Paper i proceeding
2008
Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging
Johan Liu, Yifeng Fu, Teng Wang
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. E3-01
Paper i proceeding
2008
A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers
Yi Fan, Yifeng Fu, Yan Zhang et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-05
Paper i proceeding
2008
Effect of Encapsulation on OLED Characteristics with Anisotropic Conductive Adhesive
Yan Zhang, Måns Andreasson, Johan Liu
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 613-616
Paper i proceeding
2008
Recent Progress of Thermal Interface Material Research – An Overview
Johan Liu, Bruno Michel, Marta Rencz et al
Therminic 2008, p. 156-162
Paper i proceeding
2008
Thermal cycling aging effect on the shear strength, microstructure, IMC and initiation and propagation of surface mounted Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components
Cristina Andersson, Per-Erik Tegehall, Dag R. Andersson et al
IEEE Transactions on Components and Packaging Technologies. Vol. 31 (2), p. 331-344
Artikel i vetenskaplig tidskrift
2008
Heat transfer simulation of nanofluids in microfluidic channels
Hongjun Liu, X Wang, Minliang Zhang et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging
Paper i proceeding
2008
Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material
Björn Carlberg, Teng Wang, Yifeng Fu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1395-1400
Paper i proceeding
2008
Overview of Carbon Nanotubes as Off-Chip Interconnects
Xia Zhang, Teng Wang, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference
Paper i proceeding
2008
Vibration and Bucling of a carbon nanotbue inserted with a carbon chain
Zhili Hu, Ximing Guo, Johan Liu
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging, p. D1-09
Paper i proceeding
2008
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Xiangdong Zou, Yulai Gao, Qijie Zhai et al
Journal of Electronics Materials
Artikel i vetenskaplig tidskrift
2008
Electrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder
Masahiro Inoue, Johan Liu
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1147-1152
Paper i proceeding
2008
Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection
Y. Zhang, Johan Liu, Ragnar Larsson et al
Electrically Conductive Adhesives, p. 411-425
Kapitel i bok
2008
Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection
Yan Zhang, Johan Liu, Ragnar Larsson et al
Journal of Adhesion Science and Technology. Vol. 22 (14), p. 1717-1731
Artikel i vetenskaplig tidskrift
2008
Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints
Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Microelectronics Reliability. Vol. 47, p. 266-272
Artikel i vetenskaplig tidskrift
2008
Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects
Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proceedings of the 22nd International Congress of Theoretical and Applied Mechanics
Paper i proceeding
2008
A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers
Yi Fan, Yifeng Fu, Yan Zhang et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
Paper i proceeding
2008
Vibration and buckling of a carbon nanotube inserted with a carbon chain
Zili Hu, X. Guo, Johan Liu
Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Paper i proceeding
2008
Recent Advances in the Synthesis of Lead-free Solder Nanoparticle
Cristina Andersson, Changdong Zou, Bin Yang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 915-922
Paper i proceeding
2008
Recent Progress of Thermal Interface Materials
Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 351-358
Paper i proceeding
2008
Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant
Yi Fan, Yifeng Fu, Teng Wang et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1391-1394
Paper i proceeding
2008
Nanostructured Polymer-metal Composite for Thermal Interface Material Applications
Björn Carlberg, Teng Wang, Yifeng Fu et al
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC), p. 191-197
Paper i proceeding
2008
Development of Nanomaterials and Devices for Electronics Cooling and Interconnect
Johan Liu, Teng Wang, Björn Carlberg et al
Proceedings of the Ecology in Electronics Conference in “Progress in Eco-Electronics”, as Monongraphies of Tele, Radio Institute, p. 33-47
Kapitel i bok
2008
Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material
Cong Yue, Yan Zhang, Johan Liu et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008, p. C1-10
Paper i proceeding
2008
Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load
Yan Zhang, Johan Liu, Ragnar Larsson
Journal of Electronic Packaging, Transactions of the ASME. Vol. 130 (2), p. 0210101-0210107
Artikel i vetenskaplig tidskrift
2008
Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application
Li Xu, Cong Yue, Johan Liu et al
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008
Paper i proceeding
2008
The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish
Lili Zhang, Cristina Andersson, Johan Liu et al
Proceedings of the 2nd Electronics Systemintegration Technology Conference, p. 1295-1300
Paper i proceeding
2008
Millimeter-wave ultra-wideband bandpass filter based on LCP substrates for automotive radar systems
Xia Zhang, Johan Liu, Peng Cai et al
Journal of Microwave and Optical Technology Letters, p. 2276-2280
Artikel i vetenskaplig tidskrift
2008
Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications
Cristina Andersson, Peng Sun, Johan Liu
Journal of Alloys and Compounds. Vol. 457 (1/2), p. 97-105
Artikel i vetenskaplig tidskrift
2008
Preparation of polysulfoneamide electrospinning nanofibers
Liu Li, Ying Shi, Qinghua Jiao et al
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging
Paper i proceeding
2008
Användning av ett kompositmaterial som termiskt kontaktmaterial för mikroelektroniska komponenter
Johan Liu, Dongkai Shangguan
Patent
2008
Recent Development of Nano-solder Paste for Electronics Interconnect Applications
Johan Liu, Cristina Andersson, Yulai Gao et al
Proceedings of the IEEE 10th Electronics Packaging Technology Conference
Paper i proceeding
2008
Understanding BGA interconnect interface behaviour using Micropolar theory
Yan Zhang, Ragnar Larsson, Johan Liu
Journal of Electronics Packaging
Artikel i vetenskaplig tidskrift
2008
Effect of Corrosion on the Low Cycle Fatigue Behaviour of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints
Cristina Andersson, Johan Liu
International Journal of Fatigue, p. 917-930
Artikel i vetenskaplig tidskrift
2007
A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array
Johan Liu, Yan Zhang, Teng Wang
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper i proceeding
2007
Electrically Conductive Adhesives
James E. Morris, Johan Liu
Micro- and Opto-Electronic Materials and Structures – Physics, Mechanics, Design, Reliability, Packaging, Volume II: Physics Design – Reliability and Packaging, p. 527-570
Kapitel i bok
2007
Encapsulation of OLED device by Using Anisotropic Conductive Adhesive
Yan Zhang, Måns Andreasson, Hua Zhou et al
Proceedings of 2007 International Symposium on High Density Packaging and Microsystem Integration, p. 314-317
Paper i proceeding
2007
Reliability characterisation of lead free solder joints using three point bending test
Johan Liu
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper i proceeding
2007
Electrospun Nano-fibrous Polymer Films with Barium Titanate Nanoparticles for Embedded Capacitor Applications
Björn Carlberg, Jonas Norberg, Johan Liu
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC)
Paper i proceeding
2007
PBGA Interconnect Behavior under Thermal Effects
Yan Zhang, Johan Liu, Ragnar Larsson
Proceedings of International Conference on Electronics Packaging (ICEP2007), Tokyo, Japan, p. 329-334
Paper i proceeding
2007
Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection
Teng Wang, Björn Carlberg, Johan Liu
Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibition: EMPC2007
Paper i proceeding
2007
An aging study of intermetallic compounds formation in Sn-0.4Co-0.7Cu
Johan Liu
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper i proceeding
2007
Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material
Johan Liu, Björn Carlberg
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper i proceeding
2007
Process and pad design optimization for 01005 passive component surface mount assembly
Johan Liu
Soldering and Surface Mount Technology. Vol. 19, p. 34-44
Artikel i vetenskaplig tidskrift
2007
Second order multi-scale micropolar model for microsystem interconnections
Yan Zhang, Johan Liu, Jing-yu Fan et al
Proceedings of the Fifth International Conference on Nonlinear Mechanics (ICNM-V), p. 1434-1439
Paper i proceeding
2007
Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive
Teng Wang, Björn Carlberg, Martin Jonsson et al
Applied Physics Letters. Vol. 91 (9), p. 093123-
Artikel i vetenskaplig tidskrift
2007
Effect of different temperature cycling profiles on the crack initiation and propagation and of Sn-3.5Ag wave soldered joints
Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Microelectronics and Reliability. Vol. 47 (2-3), p. 266-272
Artikel i vetenskaplig tidskrift
2007
Interface modelling microsystem interconnections using micropolar theory and discontinuous approximation
Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Computers & Structures. Vol. 85 (19-20), p. 1500-1513
Artikel i vetenskaplig tidskrift
2007
A Study of Effects of Different Coolants on On-chip Cooling with Carbon Nanotube Micro-fin Architectures by Using Computational Fluid Dynamics Simulation
Johan Liu, Yan Zhang, Teng Wang
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper i proceeding
2007
Advances in Europe - China Green Electronics Collaboration
Johan Liu
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper i proceeding
2007
Tensile fracture behaviour of Sn-3.0Ag-0.5Cu solder joints on copper
Johan Liu, Peng Sun
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper i proceeding
2007
Manufacturing and Characterisation of Silver nano particles based Nano Thermal Interface material
Johan Liu
proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC)
Paper i proceeding
2007
Effect of Corrosion on the Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-Free Solder Joints
Cristina Andersson, Johan Liu
International Journal of Fatigue
Artikel i vetenskaplig tidskrift
2007
Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders
Johan Liu
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper i proceeding
2007
Realization of A Ultra Wideband BPF based on LCP Substrate for Wireless Application
Xia Zhang, Herbert Zirath, Johan Liu
International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper i proceeding
2007
Reliability aspects of electronics packaging technology using anisotropic conductive adhesives
Johan Liu, Liqiang Cao
Journal of Shanghai University (English Edition). Vol. 11, p. 1-16
Artikel i vetenskaplig tidskrift
2007
A method for determining elastic properties of micron-sized polymer particles by using flat punch test
Johan Liu
Computational Materials Science. Vol. 39 (2), p. 305-314
Artikel i vetenskaplig tidskrift
2007
Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
Sun Peng, Cristina Andersson, Johan Liu
Journal of Alloys and Compounds
Artikel i vetenskaplig tidskrift
2007
Investigation of the Effect of Processing Variables on the Structure and Morphology of Nano-TIM
Johan Liu
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Paper i proceeding
2006
Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures
Xiaolong Zhong, Yan Zhang, Teng Wang et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 117-123
Paper i proceeding
2006
Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging
Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 166-170
Paper i proceeding
2006
Design for Embedded Chinese Display Smart Card
Hua Zhou, Yang Liu, Dimitar Antonov Kolev et al
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06; Shanghai; China; 27 June 2006 through 28 June 2006, p. 152-156
Paper i proceeding
2006
Characterization of Nanoparticles of Lead Free Solder Alloys
Wanbing Guan, Suresh Chand Verma, Yulai Gao et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 7-12
Paper i proceeding
2006
Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering
Peng Sun, Cristina Andersson, Xicheng Wei et al
Materials Science & Engineering B: Solid-State Materials for Advanced Technology. Vol. 135 (2), p. 134-140
Artikel i vetenskaplig tidskrift
2006
Development and Characterization of Microcoolers using Carbon Nanotubes
Teng Wang, Martin Jönsson, Zhimin Mo et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 881-885
Paper i proceeding
2006
Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing
Peng Sun, Cristina Andersson, Johan Liu et al
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 760-767
Paper i proceeding
2006
High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization
Peng Sun, Cristina Andersson, Xicheng Wei et al
Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), p. 1468-1475
Paper i proceeding
2006
Assessment of Lead-Free Inert Gas Soldering Using a Novel Reflow Technology
Oyebode Ayoade, Andersson Cristina, Hjertkvist Tobias et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 428-437
Paper i proceeding
2006
Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly
Fabien Raugi, Mohammad Kamruzzaman Chowdhury, Helge Kristiansen et al
1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006, p. 828-833
Paper i proceeding
2006
Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint
C. Bailey, Peng Sun, Xicheng Wei et al
Soldering and Surface Mount Technology. Vol. 18 (2), p. 4-11
Artikel i vetenskaplig tidskrift
2006
Consequential toxicity assessment of the global shift to Pb free solder paste
Anders Andrae, Johan Liu
Proceedings of the International Conference on Electronic Packaging (ICEP 2006), p. 298-303
Paper i proceeding
2006
Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection
Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proc. 1 st Electronics Systemintegration Technology Conference, 2006 (ESTC 2006), 5 - 7 Sept. 2006, Dresden, Germany. Vol. 2, p. 757-761
Paper i proceeding
2006
New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications
Wen Xuan Wang, Xiuzhen Lu, Johan Liu et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 631-635
Paper i proceeding
2006
RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints
Xu Wang, Zhaonian Cheng, Johan Liu
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 123-127
Paper i proceeding
2006
Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions
Cristina Andersson, Johan Liu
ESTC 2006 - 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006, p. 457-467
Paper i proceeding
2006
Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty
Cristina Andersson, Peng Sun, Johan Liu
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 19-26
Paper i proceeding
2006
Integrated inductors on liquid crystal polymer substrate for RF applications
Gang Zou, Hans Gronqvist, Johan Liu
Circuit World. Vol. 32 (1), p. pp41-44
Artikel i vetenskaplig tidskrift
2006
Interface Modelling of ACA Interconnects Using Micropolar Theory
Yan Zhang, Ragnar Larsson, Johan Liu
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05; Shanghai; China; 27 June 2005 through 29 June 2005, p. Art. no. 4017426-
Paper i proceeding
2006
Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application
Qi Zhang, Zonghe Lai, Urban Jevelstam et al
Proceedings of the International Conference on Electronic Packaging (ICEP 2006), p. 83-89
Paper i proceeding
2006
Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
Si Chen, Peng Sun, Johan Liu et al
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, p. 368-373
Paper i proceeding
2006
Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy
Cristina Andersson, L. Liu, Johan Liu
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany, p. 152-160
Paper i proceeding
2006
Development of nanosolders and nanothermal interface materials and cooling devices based on nanocarbon tubes
Johan Liu
Proceedings of International Microelectronics and Packaging Conference (IMAPS) Nordic, September 17-19, 2006, Göteborg, Sweden
Paper i proceeding
2006
Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
Teng Wang, Martin Jönsson, Eleanor E B Campbell et al
1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. Vol. 2, p. 892-895
Paper i proceeding
2006
Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC
Bo Zhang, Vignesh Murugesan, Niklas Billström et al
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), p. 325-328
Paper i proceeding
2006
New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging
Johan Liu
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Paper i proceeding
2006
Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications
Tomas Aronsson, Wen Xuan Wang, Michael Olugbenga Olorunyomi et al
8th IEEE International Conference on Electronic Materials and Packaging (EMAP), p. 196-199
Paper i proceeding
2006
Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Journal of Electronic Packaging, Transactions of the ASME. Vol. 128 (3), p. 177-183
Artikel i vetenskaplig tidskrift
2006
High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization
Peng Sun, Cristina Andersson, Xi-cheng Wei et al
Journal of Alloys and Compounds. Vol. 425 (1-2), p. 191-199
Artikel i vetenskaplig tidskrift
2006
Development of SOP Module Technology Based on LCP Substrate for High Frequency Electronics Applications
Xia Zhang, Qi Zhang, Gang Zou et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 118-125
Paper i proceeding
2006
On the heat transfer enhancement based on micro-scale air impingingment jets with microstructure heat sink in electronics cooling
Jingyu Fan, Yan Zhang, Johan Liu
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06; Shanghai; China; 27 June 2006 through 28 June 2006, p. 120-124
Paper i proceeding
2006
Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles
Suresh Chand Verma, Wanbing Guan, Cristina Andersson et al
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), p. 282-286
Paper i proceeding
2005
Reliability of Conductive adhesives
Johan Liu, Zhimin Mo
Lead-Free Solder Interconnect Reliability
Artikel i vetenskaplig tidskrift
2005
Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints
Peng Sun, Cristina Andersson, Xicheng Wei et al
Soldering and surface Mount Technology. Vol. 17 (4), p. pp38-45
Artikel i vetenskaplig tidskrift
2005
Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications
Johan Liu, Yu Wang, James Morris et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp156-172
Paper i proceeding
2005
Integrated Capacitors and Resistors on Liquid Crystal Polymer Substrate
Gang Zou, Hans Gronqvist, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp305-308
Paper i proceeding
2005
Reliability analysis of embedded chip technique with design of experiment methods
Xiuzhen Lu, Liu Chen, Zhaonian Cheng et al
2005 International Symposium on Electronics Materials and Packaging, p. pp43-49
Paper i proceeding
2005
Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation
Yan Zhang, Ragnar Larsson, Jing-yu Fan et al
Proc. The 5th Int. IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, (Polytronic 2005), October 23-26, Warsaw, Poland
Paper i proceeding
2005
Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation
Yan Zhang, Ragnar Larsson, Jingyu Fan et al
Proceedings of 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2005), p. 176-179
Paper i proceeding
2005
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Cristina Andersson, Zonghe Lai, Johan Liu et al
Materials Science and Engineering. Vol. A (394), p. pp20-27
Artikel i vetenskaplig tidskrift
2005
Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate
Liqiang Cao, Zonghe Lai, Johan Liu
Journal of Electronics packaging. Vol. 127, p. pp43-46
Artikel i vetenskaplig tidskrift
2005
Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications
Liqiang Cao, Shiming Li, Zonghe Lai et al
Journal of Electronic Materials. Vol. 34, p. 1420-1427
Artikel i vetenskaplig tidskrift
2005
A General Weibull Model For Reliability Analysis Under Different Failure Criteria Application on Anisotropic Conductive Adhesive Joining Technology
Johan Liu, Liqiang Cao, Min Xie et al
IEEE Transactions on Electronics Packaging Manufacturing (TEPM). Vol. 28 (4), p. 322-327
Artikel i vetenskaplig tidskrift
2005
Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling
Lisa Ekstrand, Zhimin Mo, Yan Zhang et al
Proceedings of the IEEE CPMT Polytronic 05 Conference 2005, p. 185-187
Paper i proceeding
2005
Characterization of thermally conductive epoxy nano-composites
Lisa Ekstrand, Helge Kristiansen, Johan Liu
28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005; Wiener Neustadt; Austria; 19 May 2005 through 20 May 2005, p. 35-39
Paper i proceeding
2005
Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation
Yan Zhang, Ragnar Larsson, Jingyu Fan et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp115-119
Paper i proceeding
2005
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Cristina Andersson, Zonghe Lai, Johan Liu
Materials Science and Engineering A. Vol. 394, p. 20-27
Artikel i vetenskaplig tidskrift
2005
Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive
Liqiang Cao, Zhaonian Cheng, Zonghe Lai et al
Proceedings of the 2005 International Conference on Electronics Packaging (ICEP), p. pp48-55
Paper i proceeding
2005
Reliability of conductive adhesives in electronics packaging
Johan Liu, Xiuzhen Lu, Liqiang Cao
The 4th IEEE International IEEE CPMT Conference on Polytronics (Polytronik´05), p. pp24-26
Artikel i vetenskaplig tidskrift
2005
Development of an ontology for the ACA technology in electronics applications
Johan Liu, Yu Wang, James Morris
10th International Symposium and Exhibition on, Advanced Packaging Materials. Vol. 8 (1)
Paper i proceeding
2005
An Ontology of ICA for Microsystem applications
Jim Morris, Jeahuck Lee, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp120-127
Paper i proceeding
2005
Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity
Peng Sun, Cristina Andersson, Zonghe Lai et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp197-202
Paper i proceeding
2005
Thermal cycling and reliability of lead free BGA components
Cristina Andersson, Dag Andersson, Johan Liu
IMAPS Europe Brugge, p. pp101-108
Paper i proceeding
2005
Adhesion study of copper layer deposited and liquid crystalline polymer for electronics packaging
Qi Zhang, Johan Liu, Lars Nyborg
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp109-114
Paper i proceeding
2005
Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive
Zhaonian Cheng, Lisa Ekstrand, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp139-144
Paper i proceeding
2005
Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint
Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp342-347
Paper i proceeding
2005
Reliability of Conductive adhesives
Johan Liu, Zhimin Mo
Lead-Free Solder Interconnect Reliability
Kapitel i bok
2005
Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Journal of Electronic Packaging. Vol. 3, p. pp343-349
Artikel i vetenskaplig tidskrift
2005
Application of Simplified Methods for Partial Environmental Assessment of Microelectronics Soldering Materials and Processes in Small and Medium Sized Enterprises
Anders Andrae, Dag Andersson, Cecilia Ramberg et al
International Journal of Life Cycle Assessment. Vol. 10 (5)
Artikel i vetenskaplig tidskrift
2005
Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling
Yan Zhang, Jingyu Fan, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp360-364
Paper i proceeding
2005
Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints
Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Proceedings of the IMAPS 2005, p. 523-528
Paper i proceeding
2005
THERMAL MODELING FOR SYSTEM-IN-A-PACKAGE BASED ON EMBEDDED CHIP STRUCTURE
Liu Chen, Lisa Ekstrand, Johan Liu
Proceedings of the 5th IEEE International Conferences on Adhesives and Polymers (POLYTRONIK05), p. 224-227
Paper i proceeding
2005
Design for Manufacturability and Reliability of Embedded Display Smart Card
Yang Liu, Rui Rodrigues, Johan Liu
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp476-478
Paper i proceeding
2005
Characterisation of Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive
H. Kristiansen, Z. Zhang, Johan Liu
10th International Symposium and Exhibition on, Advanced Packaging Materials. Vol. 8 (2)
Paper i proceeding
2005
Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint
Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. 696-700
Paper i proceeding
2005
Integrated Nanotube Microcooler for Microelectronics Applications
Zhimin Mo, Raluca Morjan, Johan Anderson et al
Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. pp51-54
Paper i proceeding
2005
Significance of intermediate production processes in life cycle assessment of electronic products assessed using a generic compact model
Anders Andrae, Dag Andersson, Johan Liu
Journal of Cleaner Production. Vol. 13 (13-14), p. 1269-1279
Artikel i vetenskaplig tidskrift
2004
Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints
Gang Zou, Hans Grönqvist, Johan Liu
IEEE CPMT Part A. Vol. 27 (3), p. pp 546-550
Artikel i vetenskaplig tidskrift
2004
Characterization of Metal- coated Polymer Spheres and its Use in Anisotropic Conductive Adhesive
H. Kristiansen, T.O. Gronlund, Johan Liu
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 259-264
Paper i proceeding
2004
LCA of Electronic Products - An environmental assessment of Gallium Arsenide Monolithic Microwave Integrated Circuit System in Package (SIP) switch product
Anders Andrae, Gang Zou, Johan Liu
International Journal of Life Cycle Assessment. Vol. 9 (1), p. 45-52
Artikel i vetenskaplig tidskrift
2004
High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive
Gang Zou, Hans Grönqvist, Zonghe Lai et al
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004. Vol. September (13-15), p. 137-140
Paper i proceeding
2004
Electron conduction through nano particles in electrically conductive adhesives
Ying Fu, Johan Liu
Micromaterials and Nanomaterials. Vol. 3, p. 104-109
Artikel i vetenskaplig tidskrift
2004
Thermodynamic assessment of Sn-Co lead-free solder system
Libin Liu, Cristina Andersson, Johan Liu
Journal of Electronic Materials. Vol. 33 (9), p. p 935-
Artikel i vetenskaplig tidskrift
2004
Uncertainty estimation by Monte Carlo Simulation applied to Life Cycle Inventory of Cordless Phones and Microscale Metallization Processes
Anders Andrae, Patrik Möller, Johan Anderson et al
IEEE Transactions on Electronics Packaging Manufacturing. Vol. 27 (4), p. 233-245
Artikel i vetenskaplig tidskrift
2004
Characterization of electrical and mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive
Helge Kristiansen, T.O Grönlund, Johan Liu
Proceedings of IMAPS Nordic Annual Conference, 26-28 September, p. 86-91
Paper i proceeding
2004
Reliability Modeling and Simulation of Anisotropic Conductive Adhesive Flip-Chip Bonding Assembly using Global/Local FEM Approach
Zhimin Mo, Johan Liu
Proc. of 6th Internal Conference on Electronic Materials & Packaging (EMAP 2004). Vol. December, p. pp 66-71
Paper i proceeding
2004
A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology
Johan Liu, Liqiang Cao, Min Xie et al
Proceedings of the Polytronik04, p. RT23-
Paper i proceeding
2004
The deformation Characterization of Conductive Particles in Anisotropically Conductive Adhesive Using FEM
Liqiang Cao, Yanli Wang, Guoliang Chen et al
Proceedings of the IMAPS Nordic Annual Conference. Vol. September (21-23), p. pp 92-97
Paper i proceeding
2004
Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04)
Paper i proceeding
2004
Process Development and Reliability for System-in-a-Package Using Liquid Crystal Polymer Substrate
Liu Chen, Xingzhong Duo, Lirong Zheng et al
ECTC04, p. pp 24-28
Paper i proceeding
2004
Thermal Fatigue Cracking of Surface Mount Conductive Adhesive Joints
Z. Mo, Zonghe Lai, S. Li et al
Soldering & Surface Mount Technology. Vol. 16 (1), p. pp 48-52
Artikel i vetenskaplig tidskrift
2004
A General Weibull Model For Reliability Analysis Under Different Failure Criteria Application on Anisotropic conductive adhesive joining technology
Johan Liu, Liqiang Cao, Min Xie et al
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004, p. 191-197
Paper i proceeding
2004
Conductive adhesives
Ying Fu, Johan Liu, Magnus Willander
Lead free electronics, p. pp 285-351
Kapitel i bok
2004
Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance
Liqiang Cao, Zonghe Lai, Johan Liu
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 254-258
Paper i proceeding
2004
Environmental Assessment of Embedded chip manufacturing Technology
Anders Andrae, Liu Chen, K. Schischke et al
Proceedings of Electronics Goes Green 2004+, Sept. 6-8, Berlin, Germany, p. 913-918
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2004
Characterization of Substrate Materials for System-in-a-Package Applications
Liu Chen, Anders Andrae, Gang Zou et al
Journal of Electronics Packaging. Vol. 126 (2), p. 195-201
Artikel i vetenskaplig tidskrift
2004
Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components
Cristina Andersson, Dag R. Andersson, Per-Erik Tegehall et al
Proceedings of the 5th international conference on thermal, mechanical and thermo-mechanical simulation and experiments in micro-electronics and micro-systems (EuroSimE). Vol. May (10th to 12th), p. pp 455-464
Paper i proceeding
2004
Integrating nano carbon tubes with microchannel cooler
Zhimin Mo, Johan Anderson, Johan Liu
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 373-376
Paper i proceeding
2004
Integrated Inductors on Liquid Crystal Polymer Substrate for RF Applications
Gang Zou, Hans Gronqvist, Johan Liu
Proc. of 6th Internal Conference on Electronic Materials & Packaging (EMAP 2004). Vol. December, p. pp 484-487
Paper i proceeding
2004
Study on thermomechanical reliability of a tunable light modulator
Zhimin Mo, Helge Kristiansen, Morten Eliassen et al
Microelectronics Reliability. Vol. 44 (2004), p. pp 779-785
Artikel i vetenskaplig tidskrift
2004
Uncertainty estimation by Monte-Carlo Simulation applied to life cycle inventory of cordless phones and microscale metallization processes
Anders Andrae, Patrik Möller, Johan Liu
Proceedings of the 2004 International IEEE Conference on Asian Green Electronics (AGEC), Jan. 5-7, Shenzhen, China, p. 206-217
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2004
Electron conduction through nano particles in electrically conductive adhesives
Ying Fu, Johan Liu
Micromaterials and Nanomaterials. Vol. 3, p. 104-
Artikel i övriga tidskrifter
2004
Microsystem Manufacturing, Assembly and Packaging Technology in Display-CardTM Applications
Junmei Duan, Johan Asplund, Johan Liu
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 290-293
Paper i proceeding
2003
Thermodynamic Assessment of Sn-Co-Cu Lead-free Solder Alloy
Libin Liu, Cristina Andersson, Johan Liu et al
Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition, p. 2003-35126
Paper i proceeding
2003
Electrical conduction characteristics of anisotropic conductive adhesive particles, Guangbin Dou
Y C Chan, Johan Liu
Journal of Electronic Packaging. Vol. 125 (4), p. 609-616
Artikel i vetenskaplig tidskrift
2003
Development of a web-based course on lead-free solders
Johan Liu, Cristina Andersson
ECTC´03, p. 739-742
Paper i proceeding
2003
Electron conduction through nano particles in electrically conductive adhesives
Y Fu, Johan Liu
Micromaterials and Nanomaterials, p. 40-45
Kapitel i bok
2003
System-on-Packaging: A Broad Perspective from System Design to Technology Development
Zheng Li- Rong, Johan Liu
Microelectronics Reliability. Vol. 43, p. 1339-1348
Artikel i vetenskaplig tidskrift
2003
Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate using the peel test with different moisture environment
Liqiang Cao, Zonghe Lai, Johan Liu
Polytroni´03, p. 309-313
Paper i proceeding
2003
Microwave-transmission, heat and temperature properties of electrically conductive adhesives
Ying Fu, Tiebing Wang, Johan Liu
IEEE CPMT Transactions. Vol. 26, p. 193-198
Artikel i vetenskaplig tidskrift
2003
Design and Development of Thin Film and LCP-Based System-on-Package Modules for RF/Wireless Applications
Z. Duo, L. Zheng, H. Tenhunen et al
Proceedings of The 4th Pori Electronics Production and Packaging Technology Conference, p. 205-213
Paper i proceeding
2003
Thermal Stress Analysis of a Novel Light Modulator
Zhimin Mo, Helge Kristiansen, Morten Eliassen et al
ECTC53, p. 1408-1412
Paper i proceeding
2002
Development of a generic data collection model for upstream processes in life cycle inventory of electronic products
Anders Andrae, Johan Liu
Proceedings of First International Conference on Design And Manufacturing for Sustainable Development, p. 241-253
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2002
Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film
Yilan Kang, Johan Liu, Zonghe Lai et al
The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02), p. 123-125
Paper i proceeding
2002
Formulation and electrical and mechanical properties of anisotropic conductive adhesive pastes
Liqiang Cao, Shiming Li, Johan Liu
Proceedings of the 2002 Internatinal Conference on Electronics Packaging (2002 ICEP), p. 272-277
Paper i proceeding
2002
Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy
L. Ye, Zonghe Lai, Johan Liu et al
Proceedings of the IMAPS Nordic Conference, p. 180-187
Paper i proceeding
2002
Reliability of ACA flip-chip joints on FR-4 substrate
Johan Liu, Zonghe Lai
Journal of Electronics packaging, p. 240-245
Artikel i vetenskaplig tidskrift
2002
Development and Characterization of Single Mode Microwave Cured Adhesives for Electronics Packaging Application,
Shiming Li, Johan Liu
ECTC´02, p. 1147-1150
Paper i proceeding
2002
High frequency characteristics of Liquid Crystal Polymer for System in a Package Application
Gang Zou, Hans Grönqvist, Piotr Starski et al
2002 8th International Advanced Packaging Materials Symposium, p. 337-341
Paper i proceeding
2002
A generic model for life cycle inventory of up-stream processes in life cycle assessment of electronic products
Andrae Anders S. G., Johan Liu
First International Conference on Design and Manufacture for Sustainable Development, p. 241-254
Paper i proceeding
2002
Panel-Size Component Integration (PCI) with Molded Liquid Crystal Polymer (LCP) Substrates
J. Kivilahti, Johan Liu, J. E. Morris et al
ECTC´02, p. 955-961
Paper i proceeding
2002
Web Course on Electrically Conductive Adhesives
Johan Liu, James E. Morris, Xitao Wang et al
ECTC´02, p. 1502-1506
Paper i proceeding
2002
Electrical Characterization of Isotropic Conductive Adhesive under Mechanical Deformation
Zhimin Mo, Xitao Wang, Tiebing Wang et al
Journal of Electronics Materials, p. 916-920
Artikel i vetenskaplig tidskrift
2002
Characterization of Liquid Crystal Polymer for High Frequency System-in-a-Package Applications
Gang Zou, Hans Grönqvist, Piotr Starski et al
IEEE CPMT Transactions, Part B. Vol. 25, p. 503-508
Artikel i vetenskaplig tidskrift
2002
Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application
Liu Chen, Midhat Crinic, Zonghe Lai et al
IEEE Transactions on Electronics Packaging Manufacturing. Vol. 25, p. 247-278
Artikel i vetenskaplig tidskrift
2002
Behaviour and Properties of Conductive Particles for Anisotropic Conductive Adhesive
Helge Kristiansen, Johan Liu
The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02), p. 111-114
Paper i proceeding
2002
Isotropically Conductive Adhesives for Large Power Electronics Applications
Kristian Olsson, D. Johansson, Shiming Li et al
proceedings of the second International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, p. 29-37
Paper i proceeding
2001
The effect of bump height on the reliability of ACF in flip-chip
C.M.L Wu, Johan Liu, N. H Yeung
Soldering & Surface Mount Technology, p. 25-30
Artikel i vetenskaplig tidskrift
2001
Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders
Cristina Andersson, Xitao Wang, Zonghe Lai et al
Proceedings of the IMAPS Nordic, p. 298-303
Paper i proceeding
2001
Thermal Performance of a System in Package Design Concept
D. C. Whalley, Johan Liu
Proceedings of APACK 2001 International Conference on Advances in Packaging, p. 461-467
Paper i proceeding
2001
Development of an internet Course on Conductive Adhesives for Electronics Packaging
Johan Liu, Xitao Wang, James E. Morris
ECTC 51th, p. 1270-1275
Paper i proceeding
2001
Spatial distribution of metal fillers in isotropically conductive adhesive, Journal of Electronics Materials
Ying Fu, Magnus Willander, Johan Liu
Journal of Electronics Materials. Vol. 30, p. 866-871
Artikel i vetenskaplig tidskrift
2001
ACA bonding technology for low-cost electronics packaging applications – current status and remaining challenges
Johan Liu
Soldering and Surface Mount Technology, p. 39-57
Artikel i vetenskaplig tidskrift
2001
Life Cycle Analysis of a telephone exchange station
Anders Andrae, Ulf Östermark, Johan Liu
Journal of Electronics Manufacturing, p. 147-160
Artikel i vetenskaplig tidskrift
2001
Modelling of the anisotropic conductive adhesive assembly
David Whalley, Liu Chen, Johan Liu
Proceedings of Conference presentation at ISEPT´01, p. 319-324
Paper i proceeding
2001
Modelling of Heat Transfer for System in Package (SIP)
Jiemin Zhou, Xitao Wang, Liu Chen et al
EurosimE/2001, p. 89-94
Paper i proceeding
2001
Computational Modelling of the Anisotropic Conductive Adhesive Assembly Process
D. C. Whalley, G. Glinsky, C.J. Bailey et al
Proceedings of the 3rd International Symposium on Electronics Materials and Packaging, p. 393-398
Paper i proceeding
2001
Low Cycle fatigue of lead-free solders
Cristina Andersson, Xitao Wang, Zonghe Lai et al
The Fourth International Symposium on Electronic Packaging Technology, p. 462-470
Paper i proceeding
2001
Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead Free Solders
L.L Ye, Zonghe Lai, Johan Liu
Soldering and Surface Mounting Technology, p. 16-20
Artikel i vetenskaplig tidskrift
2001
Overview of Conductive Adhesive Joining and Bumping Technology for direct chip attach applications
Helge Kristiansen, Johan Liu
Area Array Interconnection Handbook
Kapitel i bok
2001
Life time prediction of anisotropic conductive adhesive joint for electronics packaging applications
Johan Liu
Proceedings of the 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, p. 209-212
Paper i proceeding
2001
Statistics on conduction in ACA materials
Ying Fu, Magnus Willander, Johan Liu
IEEE Transactions on Components and Packaging Technology, p. 250-5
Artikel i vetenskaplig tidskrift
2001
Fundamentals of Packaging Materials and Processes
Pulugurtha Markondeya Ray, Johan Liu, Per Öchlckers
Fundamentals of Microsystems Packaging, p. 694-747
Kapitel i bok
2001
A review of microwave curing of polymer materials
Tiebing Wang, Johan Liu
Journal of Electronics Manufacturing, p. 181-189
Artikel i vetenskaplig tidskrift
2001
Microwave Cure of Metal-filled Electrically Conductive Adhesives
Tiebing Wang, Ying Fu, Matthias Becker et al
ECTC 51th, p. 593-597
Paper i proceeding
2001
Comparison of Mechanical Fatigue Test and Thermal Cycling for Failure Analysis of Solder Joints
Xitao Wang, Liu Chen, Zonghe Lai et al
Proceedings of The IMAPS Nordic 38th Annual Conference, p. 70-77
Paper i proceeding
2000
Microstructural coarsening of lead-free solders
Lilei Ye, Zonghe Lai, Johan Liu
ECTC50, p. 134-137
Paper i proceeding
2000
Microwave transmission, heating of electrically conductive adhesives
Ying Fu, Tiebing Wang, Johan Liu
Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, p. 134-139
Paper i proceeding
2000
Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application
Kuntjoro Pinardi, Zonghe Lai, Dietmar Vogel et al
IEEE CPMT Transactions, Part A. Vol. 23, p. 447-451
Artikel i vetenskaplig tidskrift
2000
Life Cycle Assessment of a telecommunications exchange
Anders Andrae, Ulf Östermark, Johan Liu
Journal of Electronics Manufacturing. Vol. 10 (3), p. 147-160
Artikel i vetenskaplig tidskrift
2000
An Internet Course on Conductive Adhesives for Electronics Packaging
Johan Liu, James Morris
ECTC 50th, p. 1016-1020
Paper i proceeding
2000
Reliability of ACF in Flip-Chip with Various Bump Height
C M L Wu, Johan Liu, N H Yeung
Proceedings of the 4th Adhesive joining and Coating Technology in Electronics Manufacturing, p. 101-106
Paper i proceeding
2000
Heating and reliability characterization electrically conductive adhesives using variable frequency microwave cure
Tiebing Wang, Ying Fu, Matthias Becker et al
3rd EPTC'2000, p. 373-377
Paper i proceeding
2000
Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives
Ying Fu, Yanli Wang, Xitao Wang et al
IEEE CPMT transactions, Part B: Advanced Packaging. Vol. 23, p. 15-21
Artikel i vetenskaplig tidskrift
2000
Effect of thermal ageing on the shear strength of lead-free solder joints
James Oliver, Johan Liu
Proceedings of the International Conference on ”Advanced Packaging Materials Processes, Properties and Interfaces”, p. 152-157
Paper i proceeding
2000
3. Thermal cycling life Flip-Chip On Board circuits with solder and isotropically conductive adhesive joints
Jon B Nysæther, Zonghe Lai, Johan Liu
IEEE CPMT Transactions, Part B: Advanced Packaging. Vol. 23, p. 743-749
Artikel i vetenskaplig tidskrift
2000
Fatigue properties of lead-free solders
Xitao Wang, Cristina Andersson, Zonghe Lai et al
Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, p. 163-169
Paper i proceeding
2000
Cluster effects on electrical conductance of isotropically conductive adhesive
Fu Ying, Magnus Willander, Johan Liu
Proceedings of the 4th Adhesive joining and Coating Technology in Electronics Manufacturing, p. 188-193
Paper i proceeding
2000
Heat Transfer Modeling of System in Package (SIP)
Jiemin Zhou, Xitao Wang, Liu Chen et al
Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, p. 107-125
Paper i proceeding
2000
Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints
K. Pinardi, Zonghe Lai, Yi Lan Kang et al
ECTC 50th, p. 1118-1121
Paper i proceeding
2000
Characterization of bulk mechanical properties of lead-free solders
Li Xiao, Johan Liu
Proceedings of the International Conference on ”Advanced Packaging Materials Processes, Properties and Interfaces”, p. 145-151
Paper i proceeding
Visar 25 forskningsprojekt
2018–2018
Funktionaliserad grafenförstärkt beläggning
Johan Liu
Elektronikmaterial och system
VINNOVA
2018–2020
Förbättrade cementbaserad ytskydd/reparation materialer med utnyttjande av två-dimensionella material
Johan Liu
Elektronikmaterial och system
Formas
2017–2019
Miniatyriserad kryokylare baserad på grafen
Johan Liu
Elektronikmaterial och system
VINNOVA
2017–2017
Värmespridare och värmeöverförande element med grafenbaserade filmer för radar och laser
Torbjörn Nilsson
Elektronikmaterial och system
Johan Liu
Elektronikmaterial och system
VINNOVA
2017–2017
Grafenförstärkt betong för lättvikts stängsel
Johan Liu
Elektronikmaterial och system
VINNOVA
2016–2017
Grafenförstärkta betongpålar - industrialisering av funktionaliserad grafen i betong
Johan Liu
Elektronikmaterial och system
Luping Tang
Byggnadsteknologi
VINNOVA
2016–2016
Long-term performance monitoring of concrete structures using a novel graphene-based DURAble SENSor
Sotirios Grammatikos
Byggnadsteknologi
Johan Liu
Elektronikmaterial och system
VINNOVA
2016–2020
Nanoteknikstödd tillverkning av högpresterande sinterstål
Lars Nyborg
Material och tillverkning
Eduard Hryha
Material och tillverkning
Johan Liu
Mikroteknologi och nanovetenskap (MC2)
Stiftelsen för Strategisk forskning (SSF)
2016–2018
Pilot line production of functionalized CNTs as thermal interface material for heat dissipation in electronics applications (SMARTHERM)
Johan Liu
Elektronikmaterial och system
Europeiska kommissionen (Horisont 2020)
2015–2016
Miniatyriserad kryokylare baserad på grafen
Johan Liu
Elektronikmaterial och system
VINNOVA
2015–2019
Graphene reinforced composite for asphalt pavements
Luping Tang
Byggnadsteknologi
Johan Liu
Elektronikmaterial och system
Statens vegvesen
2015–2018
Fonon- och tunnfilmsbaserad termoelektrisk generator-HotTEG
Johan Liu
Elektronikmaterial och system
Vetenskapsrådet (VR)
2015–2017
Functionalized grafen förstärkt cementbaserade material för grönare byggnad
Johan Liu
Elektronikmaterial och system
Luping Tang
Byggnadsteknologi
Formas
2014–2015
Förstudie på Miniatyriserad kryokylare baserad på grafen
Johan Liu
Elektronikmaterial och system
VINNOVA
2014–2019
Kolbaserat höghastighet 3D GaN elektroniksystem
Johan Liu
Elektronikmaterial och system
Per Hyldgaard
Elektronikmaterial och system
Jan Stake
Terahertz- och millimetervågsteknik
Andrei Vorobiev
Terahertz- och millimetervågsteknik
Stiftelsen för Strategisk forskning (SSF)
2012–2015
Carbon Based Smart Systems for Wireless Applications (NANO RF)
Johan Liu
Elektronikmaterial och system
Murali Murugesan
Elektronikmaterial och system
Europeiska kommissionen (FP7)
2012–2015
Innovative Nano and Micro Technologies for Advanced Thermo and Mechanical Interfaces (NANOTHERM)
Johan Liu
Elektronikmaterial och system
Europeiska kommissionen (FP7)
2012–2015
Skalbar Nanomaterial och lösning bearbetningsbar TEG
Johan Liu
Elektronikmaterial och system
Stiftelsen för Strategisk forskning (SSF)
2012–2014
Utveckling, karaktärisering och tillförlitlighetsanalys av högpresterande nanobaserade gränsskiktsmaterial
Johan Liu
Elektronikmaterial och system
VINNOVA